Folded Display Substrate Bonding Region for Narrow Bezel Modules

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Solution Overview

Problem

The challenge in flexible display technology is to reduce the volume and space occupied by the flexible display module to enhance the competitiveness of flexible display products, particularly in achieving a narrow bezel design.

Innovation Solution

A display substrate design that includes a bonding region with a first and second bending area, allowing the bonding pin area to be bent towards the display region's back surface, reducing the thickness and volume of the flexible display module by optimizing the space utilization.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If conducting Pad bending is used to achieve narrow bezel design, then the bezel width is reduced, but the volume and space occupied by the flexible display module increases

Engineering Contradiction:
Improvebezel widthVSAvoidflexible display module volume
Core Design Contradiction:
Area of stationary objectVSVolume of moving object

Solution Approach 1:

The patent transitions the bonding pin area from a planar arrangement to a three-dimensional folded structure. By introducing first and second bending areas that fold the bonding region toward the display region, the design utilizes the Z-dimension (thickness direction) to relocate bonding pins, thereby reducing their footprint in the X-Y plane and enabling narrow bezel design without increasing overall module volume.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The bonding pin area is nested within the folded structure by folding the bonding region toward the display region. The first bending area folds the transition connection area and second bending area toward the display region, and the second bending area further folds the bonding pin area toward the display region, creating a nested, space-efficient configuration that minimizes the volume occupied by the flexible display module.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Volume of moving object

If bonding pin area is folded toward display region, then space utilization is improved, but the structural complexity increases

Engineering Contradiction:
Improveflexible display module volumeVSAvoidbonding region structure complexity
Core Design Contradiction:
Volume of moving objectVSDevice complexity

Solution Approach 1:

The bonding region is segmented into distinct functional areas: transition connection area, first bending area, second bending area, and bonding pin area. This segmentation allows each area to perform its specific function independently while maintaining overall structural integrity, making the complex folded structure manageable and manufacturable.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent employs curved bending areas with controlled radii to achieve the folded configuration. The first bending area and second bending area are designed with specific curvature characteristics that enable smooth folding of the bonding region toward the display region, reducing stress concentrations and facilitating the complex spatial transformation while maintaining structural reliability.

Inventive Principle:
Principle #14Spheroidality (Curvature)

Data Source

PatentUS12514076B2Display substrate and display apparatus
Publication Date: 2025.12.30 BOE TECHNOLOGY GROUP CO LTD
  • US12514076B2 patent drawing
  • US12514076B2 patent drawing
  • US12514076B2 patent drawing

AI summary

A display substrate and a display apparatus, the display substrate includes a display region and a bonding region located on a side of the display region, the bonding region includes a first bending area close to the display region, and a transition connection area, a second bending area and a bonding pin area connected sequentially along a direction away from the first bending area, the transition connection area connects the first bending area with the second bending area; the transition connection area, the second bending area and the bonding pin area are bent to a side of the display region facing away from a display side through the first bending area; the bonding pin area is bent toward a surface of the display region facing away from the display side through the second bending area, and the bonding pin area is in bonding connection with an external circuit board.