Folded Electrode Assembly for Uniform Low-Temperature Plasma Processing
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Solution Overview
Problem
Existing substrate processing methods face challenges in uniformly processing films on substrates due to non-uniform plasma distribution, which can affect film thickness and quality, especially in mass-produced semiconductor devices with fine patterns.
Innovation Solution
A substrate processing apparatus with a configuration of primary electrodes folded back at their upper portions and secondary electrodes to which a reference potential is applied, along with a specific arrangement of electrodes to generate a uniform plasma field, ensuring consistent film formation across substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If plasma processing is used to process substrates at lower temperatures, then diffusion of impurities is suppressed and low heat resistance materials can be used, but uniform processing of films becomes difficult
Solution Approach 1:
The electrode is divided into multiple segments along the substrate processing direction, with each segment independently controllable. This segmentation allows different power levels to be applied to different regions, enabling uniform plasma distribution across the substrate surface while maintaining lower processing temperatures.
Solution Approach 2:
Different regions of the electrode are assigned different power levels based on the required plasma density distribution. The upper portion of the electrode (closer to the substrate) receives different power than the lower portion, creating local quality variations that compensate for plasma non-uniformity and achieve uniform film processing.
2Device complexity
If conventional electrode configuration is used, then device structure is simple, but plasma distribution is non-uniform affecting film quality
Solution Approach 1:
The electrode is divided into multiple segments along the substrate processing direction, with each segment independently controllable. This segmentation allows different power levels to be applied to different regions, enabling uniform plasma distribution across the substrate surface while maintaining lower processing temperatures.
Solution Approach 2:
The electrode system transitions from a static, uniform power distribution to a dynamic, variable power distribution system. By independently controlling power levels for different electrode segments, the system can adaptively optimize plasma distribution to achieve uniform film processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus achieves more uniform substrate processing by optimizing plasma distribution, leading to improved film thickness and quality uniformity on semiconductor wafers.
Implementation Method 1
a plurality of primary electrodes connected to a high frequency power supply provided outside the process chamber
Implementation Method 2
a plurality of primary electrodes connected to a high frequency power supply provided outside the process chamber
Data Source
AI summary
There is provided a technique that includes: a process chamber in which a substrate is processed; a plurality of primary electrodes connected to a high frequency power supply provided outside the process chamber, wherein each of the plurality of primary electrodes is configured to be folded back at an upper portion thereof; and a secondary electrode to which a reference potential is applied.