Folded Flex Memory Card for High Density Storage
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Solution Overview
Problem
Conventional memory cards have limited data storage capacity, which cannot keep pace with the increasing demand for data storage in mobile devices such as digital cameras, MP3 players, and telecommunication devices, as the necessary data storage capacity is doubling approximately every six months.
Innovation Solution
The integration of a flexible substrate (flex) in memory cards, which is folded to accommodate multiple standard pre-packaged memory devices, along with a stiffener and encapsulant material to provide increased capacity and structural support, allowing the memory card to support four or more standard memory devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional memory card design with single PCB is used, then manufacturing is simple, but data storage capacity is limited
Solution Approach 1:
The memory card is divided into multiple layers with separate PCB substrates (first PCB and second PCB) that are stacked and interconnected. This segmentation allows multiple memory devices to be distributed across different layers, increasing total storage capacity while maintaining manageable complexity through modular architecture.
Solution Approach 2:
The invention transitions from a single-plane PCB design to a three-dimensional stacked architecture. Memory devices are arranged on both the top and bottom surfaces of stacked PCBs, utilizing the vertical dimension to pack more storage capacity into the same footprint area.
2Quantity of substance
If multiple memory devices are integrated to increase capacity, then data storage capacity increases, but device complexity increases
Solution Approach 1:
Multiple memory devices are combined onto a single PCB substrate using array configurations. The controller integrates with multiple memory devices through a unified interface structure, managing them as a cohesive system rather than separate units, which simplifies the overall device architecture despite increased capacity.
Solution Approach 2:
The PCB substrate and controller design are created with universal compatibility to support varying numbers of memory devices. The same basic architecture can accommodate different capacity requirements by simply adding or removing memory devices from the array, making the design scalable and adaptable.
3Quantity of substance
If memory devices are arranged in array configuration, then storage capacity increases, but contact routing complexity increases
Solution Approach 1:
The PCB substrate acts as an intermediary between the controller and multiple memory devices. It provides a standardized interface layer with predefined contact patterns that simplify the connection architecture, allowing the controller to communicate with multiple memory devices through a unified routing structure rather than requiring complex direct connections.
Solution Approach 2:
The contact routing is optimized by changing the physical layout parameters of the PCB, including trace widths, spacing, and routing layers. By adjusting these parameters, the design accommodates increased numbers of memory devices while maintaining signal integrity and manufacturing feasibility.
Data Source
AI summary
A memory card comprising a flexible substrate (a “flex”) which is integrated in the memory card and folded in a prescribed manner subsequent to having various active and passive devices (e.g., controller and memory devices) surface mounted thereto. The active and passive devices are attached to a common side of the flex, and electrically connected to a conductive pattern disposed thereon. The conductive pattern itself electrically communicates with external signal contacts also formed on the flex. The use of folded flex technology in the memory card of the present invention allows the same to support four or more standard, pre-packaged memory devices, thus providing the memory card with substantially increased capacity.