Folded Flexible Circuit Board Structure for Stable Retention
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Flexible circuit boards face issues with stability when folded, as they can easily recover to their original state, leading to collisions with other electronic device components.
Innovation Solution
A method for manufacturing a flexible circuit board involves forming conductive structures, adhesive blocks, and cover films to stabilize the folded state, using materials like polyimide and copper, with etching processes to create grooves and openings, and adhesive layers to secure the folded portions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the flexible circuit board is folded to reduce space, then the space occupied is reduced, but the circuit board cannot be secured and easily recovers from the folded state
Solution Approach 1:
The circuit board is divided into a first circuit board portion and a second circuit board portion connected by a foldable portion. The foldable portion includes bending sections that can be folded along a folding line, allowing the board to be segmented into manageable parts that can be secured in a folded state while reducing overall space occupation.
Solution Approach 2:
Adhesive blocks are pre-formed on the circuit board portions before folding. These adhesive blocks are positioned to engage with corresponding structures on the other side when folded, creating a preliminary securing mechanism that maintains the folded state without requiring additional fastening operations.
2Stability of the object's composition
If adhesive blocks are formed on the circuit board to secure the folded state, then the folded state stability is improved, but the device complexity increases
Solution Approach 1:
The adhesive blocks are integrated directly into the circuit board manufacturing process, combining the adhesive application step with the circuit board fabrication. This merging eliminates the need for separate adhesive application equipment and processes, thereby securing the folded state without significantly increasing overall device complexity.
Solution Approach 2:
The adhesive blocks are formed by depositing adhesive material and then curing it through heating or UV irradiation. By changing the physical state of the adhesive from liquid to solid through these parameter changes, the folded state is secured without requiring complex mechanical fastening mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method ensures the flexible circuit board remains stable in a folded configuration, reducing the risk of collisions and damage, while allowing for efficient heat dissipation of electronic components.
Implementation Method 1
a plurality of first adhesive blocks 81 are formed on a surface of the first cover film 721 facing away from the inner wiring substrate 40 and is adhered to the first cover film 721 and the second cover film 722
Implementation Method 2
with etching processes to create grooves and openings
Implementation Method 3
the heating and curing the first adhesive blocks 81, the second adhesive blocks 82, and the third adhesive blocks 83
Data Source
AI summary
A flexible circuit board includes an inner wiring substrate, a first cover film, a second cover film, a first adhesive block, and two outer wiring substrates. The inner wiring substrate includes a dielectric layer, and the dielectric layer includes a first flat portion, a second flat portion, and a foldable portion connecting the first flat portion and the second flat portion. The first cover film is disposed on the first flat portion and located between the first flat portion and the second flat portion. The second cover layer is disposed on the second flat portion and is located between the first flat portion and the second flat portion. The first adhesive block bonds the first cover film and the second cover film, and the inner wiring substrate is located between the two outer wiring substrate. A method for manufacturing the flexible circuit board is also disclosed.