Folded Flexible Circuit Antenna Array for Lightweight Conformal Integration
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Solution Overview
Problem
Current active array architectures for large area multifunction antennas, such as those used in space and airborne systems, are heavy, costly, and lack conformality, limiting their performance and application in platforms like micro-satellites and stratospheric airships.
Innovation Solution
The development of a lightweight antenna array using a folded thin flexible circuit board with a dielectric layer and conductor pattern, forming a pleated structure, which integrates radiator structures, RF circuit devices, and signal/power manifolds on a single layer, eliminating the need for multiple layers and vias, and allowing for conformal integration on complex surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If current active array architecture is used, then antenna functionality is achieved, but weight is excessive
Solution Approach 1:
The patent employs a flexible circuit board as the substrate for the antenna array, replacing traditional rigid multilayer PCB structures. This flexible board allows the antenna to be lightweight while maintaining structural integrity and electrical performance through careful design of conductor traces and dielectric layers.
Solution Approach 2:
The patent transitions from a planar two-dimensional antenna layout to a three-dimensional folded structure. By folding the flexible circuit board, the antenna achieves increased effective radiating area and improved performance without proportionally increasing weight, as the additional dimension is created through spatial configuration rather than adding mass.
2Reliability
If multilayer active panel array is used, then antenna functionality is achieved, but cost is excessive
Solution Approach 1:
The patent combines multiple antenna elements, feed networks, and control circuits onto a single flexible circuit board layer. By integrating these previously separate multilayer components into one consolidated structure, the manufacturing process is simplified, reducing production complexity and cost while maintaining full antenna functionality.
Solution Approach 2:
The flexible circuit board serves multiple functions simultaneously: it acts as the mechanical substrate, the electrical interconnect network, the radiator support structure, and the mounting platform for active devices. This multi-functionality eliminates the need for separate specialized layers, reducing manufacturing steps and overall cost.
3Reliability
If rigid antenna structure is used, then antenna functionality is achieved, but conformality is poor
Solution Approach 1:
The patent uses a flexible circuit board that can be bent and shaped to conform to curved and irregular surfaces. This flexibility allows the antenna to adapt to various platform geometries such as satellite bus surfaces or aircraft skin contours while maintaining electrical performance through proper trace routing and structural support.
Solution Approach 2:
The antenna structure is designed to be dynamically adaptable rather than statically rigid. The flexible board can be configured into different shapes and deployed in various orientations, allowing the same antenna design to serve multiple platform types and surface geometries, thereby improving versatility without compromising performance.
4Adaptability or versatility
If folded flexible circuit board is used, then conformality is improved, but structural complexity increases
Solution Approach 1:
The patent divides the flexible circuit board into manageable sections or panels that can be independently folded and assembled. This segmentation allows complex three-dimensional configurations to be achieved through simpler, repetitive folding patterns rather than requiring monolithic complex structures, thereby reducing manufacturing complexity while maintaining conformality.
Data Source
AI summary
An antenna array includes a folded thin flexible circuit board with a thin dielectric layer and a conductor layer pattern formed on a first surface of the dielectric layer. The circuit board may be folded in a plurality of folds to form a pleated structure. An array of radiator structures is formed on the first surface, A conductor trace pattern is formed on the folded circuit board. A plurality of active RF circuit devices is attached to the folded circuit board in signal communication with the conductor trace pattern.