Folded Graphite Heat Spreader for Mobile Device Thermal Management
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Solution Overview
Problem
Increasing computing power in electronic devices leads to higher power dissipation, limiting maximum processing and operating power due to heat generation, which can result in uneven temperature distribution and reduced user convenience.
Innovation Solution
A heat spreader comprising a folded heat conductive sheet with multiple superimposed layers, configured to conduct heat from a local heat source and spread it evenly across the device, replacing conventional heat pipes and fins, and made from materials like graphite for efficient thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat pipes and fins are used for heat dissipation, then heat can be conducted away from the heat source, but the device weight increases and the structure becomes more complex
Solution Approach 1:
The patent replaces conventional mechanical heat dissipation structures (heat pipes, fins) with a heat conductive sheet made of graphite or graphite-like material. This material substitution eliminates the need for complex mechanical cooling components while maintaining effective heat dissipation through the inherent high thermal conductivity of graphite, thereby reducing device weight and structural complexity.
Solution Approach 2:
The invention uses graphite or graphite-like composite material as the heat conductive sheet. Graphite's layered structure provides exceptional in-plane thermal conductivity, enabling efficient heat spreading from localized hot spots across the device housing without requiring additional heat dissipation components, thus achieving lightweight design with effective thermal management.
2Temperature
If conventional heat pipes and fins are used for heat dissipation, then heat can be conducted away from the heat source, but the device structure becomes more complex
Solution Approach 1:
The patent replaces conventional mechanical heat dissipation structures (heat pipes, fins) with a heat conductive sheet made of graphite or graphite-like material. This material substitution eliminates the need for complex mechanical cooling components while maintaining effective heat dissipation through the inherent high thermal conductivity of graphite, thereby reducing device weight and structural complexity.
Solution Approach 2:
The heat conductive sheet serves multiple functions: it acts as both a thermal management component and a structural element of the device housing. By integrating heat dissipation functionality into the housing structure itself through the graphite sheet, the invention eliminates the need for separate cooling components, thereby simplifying the overall device structure.
3Power
If processing power is increased, then device performance improves, but heat generation increases leading to uneven temperature distribution
Solution Approach 1:
The patent applies local quality by placing the heat conductive sheet specifically at locations where heat generation occurs (near processors and other heat-generating components). The graphite sheet's high in-plane thermal conductivity rapidly distributes heat laterally from localized hot spots, creating uniform temperature distribution in the regions where it is applied most critically.
Solution Approach 2:
The invention uses graphite or graphite-like composite material as the heat conductive sheet. Graphite's layered structure provides exceptional in-plane thermal conductivity, enabling efficient heat spreading from localized hot spots across the device housing without requiring additional heat dissipation components, thus achieving lightweight design with effective thermal management.
4Temperature
If more heat dissipation components are added, then heat can be dissipated more effectively, but the device weight increases
Solution Approach 1:
The patent replaces conventional mechanical heat dissipation structures (heat pipes, fins) with a heat conductive sheet made of graphite or graphite-like material. This material substitution eliminates the need for complex mechanical cooling components while maintaining effective heat dissipation through the inherent high thermal conductivity of graphite, thereby reducing device weight and structural complexity.
Solution Approach 2:
The invention uses graphite or graphite-like composite material as the heat conductive sheet. Graphite's layered structure provides exceptional in-plane thermal conductivity, enabling efficient heat spreading from localized hot spots across the device housing without requiring additional heat dissipation components, thus achieving lightweight design with effective thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The heat spreader effectively dissipates heat without local hot spots, maintaining device performance and user comfort by evenly distributing heat to the exterior, allowing for increased processing power and reducing device weight compared to traditional cooling mechanisms.
Implementation Method 1
a folded section having at least two folds of the sheet establishing at least three superimposed layers of the sheet between the folds, wherein the folded section is configured to conduct heat from the heat source
Implementation Method 2
a layer of sheet, other than that of the three superimposed layers, wherein the layer of sheet is configured to spread heat across the electronic device, and wherein the layer of sheet receives the heat from the folded section
Data Source
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AI summary
In an embodiment, a heat spreader is disclosed. In an embodiment, the device comprises an electronic device, comprising: an electronic component as a heat source; and a heat conductive sheet, comprising; a folded section having at least two folds of the sheet establishing at least three superimposed layers of the sheet between the folds, wherein the folded section is configured to conduct heat from the heat source; and a layer of sheet, other than that of the three superimposed layers, wherein the layer of sheet is configured to spread heat across the electronic device, and wherein the layer of sheet receives the heat from the folded section; wherein the superimposed layers are closer to the heat source than the layer of sheet. An embodiment relates to a mobile device and another embodiment to a manufacturing method.