Folded Leadframe Conductor for Mechanical Support and Thermal Dissipation

The patent applies dimensionality change by folding the leadframe conductor portion to create three-dimensional structures. The conductor is folded back on itself to form multiple layers, transforming a two-dimensional planar structure into a three-dimensional folded structure. This increases the effective metal thickness and mechanical strength without adding separate components, resolving the contradiction between simplicity and strength.

The patent merges multiple functions into the folded conductor structure. The same folded metal layers that provide mechanical strength also serve as current-carrying paths. By folding the conductor back on itself, the effective cross-sectional area for current flow is doubled or tripled without adding separate conductor layers, thus improving current handling capability while maintaining manufacturing simplicity.

The folded structure creates multiple thermal conduction paths by stacking metal layers. The folded portions act as heat sinks and provide additional thermal pathways from the die attach area to the leads. This three-dimensional thermal management approach improves heat dissipation without requiring external heat sinks or complex thermal management systems.

The leadframe is segmented into distinct functional zones: planar portions for electrical connection and folded portions for mechanical reinforcement. The folding is localized to specific areas where mechanical strength is needed, such as near the die attach pad and along the leads, while other areas remain planar for electrical functionality. This selective segmentation provides strength where needed without unnecessarily complicating the entire structure.