Folded-Metal Loading Frame for High I/O CPU Socket Stability

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Solution Overview

Problem

The challenge of integrating high-performance system on chip semiconductor packages into electronic systems is exacerbated by component integration difficulties, particularly in packaging and integration, where varying CPU package heights and increased electrical interface pin counts lead to torsion force imbalances and potential damage to electrical connections.

Innovation Solution

A loading frame design with adjustable shims and improved structural elements, such as C-shaped legs and lateral torsion springs, distributes loading forces evenly and prevents bending, accommodating different CPU thicknesses and supporting high I/O count packages without excessive torsion, while using a lightweight yet robust assembly.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional loading frames are used with high I/O count CPU packages, then electrical connections may be damaged due to excessive torsion forces, but reducing frame structure results in insufficient support and stability

Engineering Contradiction:

Improveelectrical connection stabilityVSAvoidframe structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The loading frame is divided into multiple legs (e.g., four legs) that independently support different corners of the CPU package. Each leg can be independently optimized for load distribution, allowing the frame to handle high I/O count packages without excessive torsion on any single connection point.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The frame legs are designed with asymmetric C-shaped cross-sections optimized for specific loading directions. The asymmetric geometry provides enhanced torsional resistance while maintaining lightweight construction, resolving the contradiction between reliability and structural complexity.

Inventive Principle:

Principle #4Asymmetry

2Adaptability or versatility

If adjustable shims are added to accommodate varying CPU package heights, then adaptability improves, but device complexity increases

Engineering Contradiction:

ImproveCPU package height accommodationVSAvoidloading frame components

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

Adjustable shims are introduced as intermediary elements between the CPU package and the loading frame legs. These shims act as mediators that accommodate height variations without requiring complex adjustable mechanisms in the frame itself, thus improving adaptability while controlling complexity.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The shim thickness can be varied to change the effective loading distance and force distribution parameters. By adjusting this single parameter, the frame can accommodate different CPU package heights and configurations, providing versatility through simple parameter modification rather than complex structural changes.

Inventive Principle:

Principle #35Parameter changes

3Strength

If heavier frame materials are used to prevent bending under high I/O loads, then structural strength improves, but system form factor increases

Engineering Contradiction:

Improveframe anti-bending capabilityVSAvoidsystem form factor

Core Design Contradiction:

StrengthVSVolume of moving object

Solution Approach 1:

The frame legs utilize C-shaped curved cross-sections rather than straight rectangular profiles. This curvature provides superior bending resistance and torsional stiffness for the same material volume, enabling lightweight construction that maintains structural strength under high I/O loads without increasing system form factor.

Inventive Principle:

Principle #14Spheroidality (Curvature)

Solution Approach 2:

The loading frame employs composite construction combining lightweight materials with strategic reinforcement only where needed for strength. This allows the frame to achieve necessary anti-bending capability while minimizing overall weight and volume, preventing excessive form factor growth.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution ensures stable electrical connections and prevents mechanical shock-induced damage, allowing for efficient packaging of high I/O count CPUs with reduced frame weight and smaller system form factors, suitable for high-density computing environments.

Implementation Method 1

lateral torsion springs, distributes loading forces evenly and prevents bending

Methodology Applied

Scientific EffectElasticity: Elasticity

Data Source

PatentUS20260026349A1Loading frame for high I/O count packaged semiconductor chip

Publication Date: 2026.01.22 SK HYNIX NAND PRODUCT SOLUTIONS CORP

AI summary

An apparatus is described. The apparatus includes a loading frame for mounting a packaged semiconductor chip and a heat sink for the packaged semiconductor chip to a socket. The loading frame is comprised of metal. The loading frame has at least one frame leg where the metal is folded to re-enforce a strength of the frame leg.