Folded MEMS Coil Assembly for Compact Audio Reproduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional voice coils are not suitable for consumer electronics devices due to space constraints as they become more compact and internal components are proximate to each other, limiting the fitment of traditional voice coils in these devices.
Innovation Solution
A microelectromechanical system (MEMS) coil assembly is developed, comprising a substrate with folded or stacked coil segments, where conductors are arranged to form coils and electrically connected, enabling high packing factors and efficient electromagnetic motor designs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional voice coils are used, then audio signal reproduction is achieved, but the device size becomes too large for compact consumer electronics
Solution Approach 1:
The coil assembly is divided into multiple discrete coil segments (first coil segment, second coil segment, etc.) that are arranged in a stacked configuration. Each segment contains conductors forming coils, and the segmentation allows the overall assembly to be compressed into a smaller volume while maintaining the necessary electromagnetic functionality for audio reproduction
Solution Approach 2:
The coil segments are arranged in a stacked configuration along the vertical dimension rather than spreading out horizontally. This dimensional reorganization allows the coil assembly to achieve high packing density in the Z-direction while maintaining a compact footprint in the X-Y plane, effectively reducing the overall volume suitable for wearable devices
2Quantity of substance
If conventional wound coils are used, then manufacturing is simple, but packing factor is low and device size is large
Solution Approach 1:
The coil structure is segmented into multiple discrete segments with conductors arranged in specific patterns (e.g., spiral, rectangular) on each segment. This segmentation enables higher conductor density within each segment while allowing modular manufacturing processes that can be automated, balancing packing factor improvement with manufacturing feasibility
Solution Approach 2:
The design changes the geometric parameters of the coil segments, including conductor trace width, spacing, and segment dimensions, to optimize the packing factor. By carefully controlling these parameters during manufacturing, the design achieves high conductor density while maintaining compatibility with standard fabrication processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The MEMS coil assembly achieves high packing factors, efficient electromagnetic motor designs, and reduced manufacturing costs, overcoming the limitations of traditional wound coils by allowing for compact and efficient audio signal reproduction in consumer electronics.
Implementation Method 1
a first conductor arranged on the portion of the substrate to form a first coil, and a second conductor arranged on the portion of the substrate to form a second coil
Data Source
AI summary
A microelectromechanical system (MEMS) coil assembly is presented herein. In some embodiments, the MEMS coil assembly includes a foldable substrate and a plurality of coil segments. Each coil segment includes a portion of the substrate, two conductors arranged on the portion of the substrate. The substrate can be folded to stack the coil segments on top of each other and to electrically connect first and second conductors of adjacent coil segments. In some other embodiments, the MEMS coil assembly includes a plurality of coil layers stacked onto each other. Each coil layer includes a substrate and a conductor to form a coil. The conductors of adjacent coil layers are connected through a via. The MEMS coil assembly can be arranged between a pair of magnets. An input signal can be applied to the MEMS coil assembly to cause the MEMS coil assembly to move orthogonally relative to the magnets.