Folded Near-Eye Display Module Layout for Compact AR/VR Wearables

The patent applies dimensionality change by transforming the flat two-dimensional circuit board structure into a three-dimensional folded structure. The circuit board is folded along specific fold lines to create a multi-layer spatial configuration, allowing components to be arranged in different vertical levels. This three-dimensional arrangement significantly reduces the overall footprint and volume of the near-eye display module while maintaining all necessary electrical connections and component functions, thereby improving wearing comfort.

The patent implements nesting by placing the storage assembly inside the accommodation space formed by the folded circuit board structure. The storage assembly, which contains memory chips and other components, is positioned within the three-dimensional space created by the folded layers of the circuit board. This nested arrangement eliminates the need for separate housing structures and reduces overall material usage, thereby decreasing weight while maintaining structural integrity and component protection.

The patent applies segmentation by dividing the circuit board into multiple distinct sections separated by fold lines. Each section can be independently designed, manufactured, and assembled. The folded structure creates discrete spatial zones that accommodate different components (display assembly, storage assembly, processing units) in an organized manner. This segmented approach simplifies the manufacturing process and assembly procedures while achieving compact volume, as each segment can be optimized independently and then integrated through the fold lines.