Folded PCB LED Bulb for Heat Dissipation and Assembly

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Current LED lighting technologies face challenges in achieving high efficiency, heat dissipation, and cost-effective manufacturing, particularly in producing 100 W replacement bulbs with acceptable Correlated Color Temperature (CCT) and Color Rendering Index (CRI), while minimizing energy consumption and maximizing LED lumen potential.

Innovation Solution

A three-dimensional LED light bulb is created by folding a printed circuit board (PCB) into a polyhedron shape with pre-cut bending lines, incorporating multiple LEDs connected to a driver circuit and heat sinks for efficient heat dissipation, allowing for omnidirectional light emission and integration with standard light fixtures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If multiple PCBs are joined by connectors to form an LED light assembly, then the LED can achieve desired lumen output, but the manufacturing cost and assembly complexity increase significantly

Engineering Contradiction:
Improvelumen outputVSAvoidassembly complexity
Core Design Contradiction:
Illumination intensityVSDevice complexity

Solution Approach 1:

The patent combines multiple PCB segments into a single continuous flexible PCB structure with integrated circuitry and LED mounting positions. This eliminates the need for separate connectors and multiple assembly steps, reducing manufacturing complexity while maintaining the required lumen output through optimized LED placement and circuit design on the unified PCB.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The flexible PCB serves multiple functions simultaneously: it provides structural support, electrical connections, heat dissipation pathways, and LED mounting. This multi-functionality reduces the need for additional components and simplifies the overall assembly process while achieving the desired illumination performance.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Device complexity

If LEDs are overdriven to reduce the number of LEDs needed, then the device complexity decreases, but heat dissipation challenges increase and luminous efficacy reduces

Engineering Contradiction:
Improvenumber of LEDsVSAvoidheat dissipation
Core Design Contradiction:
Device complexityVSTemperature

Solution Approach 1:

The patent transitions from planar PCB mounting to three-dimensional立体 structure using flexible PCB that can be folded or shaped. This allows LEDs to be positioned in multiple spatial orientations, increasing surface area for heat dissipation and enabling better thermal management without increasing the number of LEDs or their drive current.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The flexible PCB acts as an intermediary thermal management component, providing dedicated heat dissipation pathways and thermal coupling between LEDs and heat sinks. This mediator approach enables effective heat removal without requiring higher LED drive currents, maintaining luminous efficacy while reducing the total number of LEDs needed.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Ease of manufacture

If a traditional rigid PCB structure is used, then manufacturing is straightforward, but heat dissipation efficiency and light distribution are limited

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidheat dissipation efficiency
Core Design Contradiction:
Ease of manufactureVSTemperature

Solution Approach 1:

The patent employs a flexible PCB that can be dynamically shaped or folded into optimal configurations for both manufacturing and thermal performance. The flexibility allows the PCB to conform to different heat sink geometries and light distribution requirements while maintaining ease of manufacture through standard flexible PCB fabrication processes.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides a more energy-efficient, longer-lasting LED bulb with improved heat dissipation, higher brightness, and cost-effective mass production, achieving lumens per watt efficiency comparable to or exceeding traditional lighting solutions while being environmentally friendly.

Implementation Method 1

the PCB comprising at least three layers, including at least one outer non-conductive layer and at least one internal conductive layer

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Data Source

PatentUS10030820B2LED light
Publication Date: 2018.07.24 NANOGRID LTD (HK)
  • US10030820B2 patent drawing
  • US10030820B2 patent drawing
  • US10030820B2 patent drawing

AI summary

An LED bulb comprises a structural shell formed by folding a flat PCB into a three-dimensional polyhedron shape and a fitting for removably coupling the bulb to a light socket. The PCB comprises a plurality of LEDs, at least one LED mounted electronically on a plurality of faces of the polyhedron, and a driver circuit for driving each LED. The perimeter of the PCB is shaped to join adjacent faces. Each LED produces minimal excess heat, which is partially conducted by a metallic heat sink bridge to the PCB and dissipated to the air through the PCB and through a plurality of spaces in the shell.