Folded PCB Circuit Assembly for Accurate Switching Temperature Sensing
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Solution Overview
Problem
Conventional circuit assemblies face challenges in reliably measuring the temperature of switching elements due to weak heat conduction from switching elements to the circuit board, which can lead to unreliable detection of abnormal heat production.
Innovation Solution
A circuit assembly design featuring a folded portion on the circuit board that extends towards the switching element, with a temperature measuring device mounted on this folded portion and fixed using a thermosetting material, allowing for direct contact and reliable temperature measurement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If temperature measuring devices are mounted on the circuit board with conduction portions formed as a single body with the circuit board, then the structure is simple and easy to manufacture, but the heat conduction from switching elements to the circuit board becomes weak and temperature measurement becomes unreliable
Solution Approach 1:
The patent introduces a folded portion that extends from the circuit board surface towards the switching element, creating a three-dimensional structure. This folded portion positions the temperature measuring device in close proximity to the switching element, establishing a direct thermal conduction path that bypasses the weak heat conduction through the circuit board. The dimensional change from a flat board mounting to a folded structure enables reliable temperature measurement while maintaining manufacturing simplicity.
2Temperature
If radiators with large heat capacity are used in circuit assemblies, then heat dissipation capacity is improved, but the conduction of heat from switching elements to the circuit board becomes weaker and temperature detection becomes unreliable
Solution Approach 1:
The folded portion acts as a thermal intermediary between the switching element and the temperature measuring device. It creates a dedicated thermal conduction path that is independent of the circuit board's heat conduction capability. This intermediary structure ensures that even when large radiators are used and heat conduction through the board becomes weak, the temperature measuring device can still reliably detect the switching element's temperature through the folded portion's direct thermal contact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables precise temperature measurement of switching elements, reducing the distance between the temperature measuring device and the switching element, and effectively fixes the device in place, ensuring accurate detection of overheating.
Implementation Method 1
the conduction of heat from the switching elements to the circuit board becomes weak
Implementation Method 2
a fixing portion for fixing the temperature measuring device and the folded portion to the switching element
Data Source
AI summary
A circuit assembly that includes a circuit board, a switching element that is mounted on one side of the circuit board, a folded portion that extends from a peripheral edge portion of the circuit board and is folded towards the one side, and a temperature measuring device that is mounted on the folded portion and is in contact with the switching element.