Folded Printed Connection Circuit for Flexible Multi-Layer Routing
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Solution Overview
Problem
Conventional printed circuit boards face limitations in circuit formation freedom, complexity in design and manufacturing, and noise issues due to multi-layered structures, particularly in flexible printed circuits for automotive applications.
Innovation Solution
A connection circuit is manufactured using conductive ink on a flexible base material, with parts of the base material folded to create a multi-layered structure, allowing circuits to be layered vertically and interposed with the base material for insulation, enhancing freedom in circuit formation and noise resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If circuits are formed on the same layer using conventional printing methods, then the manufacturing process is simple, but the degrees of freedom in circuit formation are low and complex circuit formation is difficult
Solution Approach 1:
The patent transitions from planar circuit formation to three-dimensional circuit formation by folding the base material. This allows circuits to be arranged in vertical layers while maintaining the simplicity of the printing process, thereby increasing the degrees of freedom in circuit formation without complicating the manufacturing method.
Solution Approach 2:
The base material is divided into multiple sections that can be folded relative to each other. This segmentation enables the formation of multi-layered circuit structures by folding, allowing complex three-dimensional circuit arrangements while keeping each individual printing step simple and straightforward.
2Adaptability or versatility
If a multi-layered structure is used to increase circuit formation freedom, then the degrees of freedom in circuit formation improve, but noise occurs between parallel circuits and design and manufacturing processes become complex
Solution Approach 1:
The folded base material acts as an intermediary insulation layer between circuits in different vertical layers. This physical separation mediated by the folded base material prevents noise coupling between parallel circuits while enabling the multi-layered structure, thus resolving the noise issue without sacrificing circuit formation freedom.
Solution Approach 2:
By utilizing the vertical dimension through folding, the patent achieves circuit separation in three-dimensional space. This spatial separation in the vertical dimension reduces electromagnetic interference and noise between parallel circuits that would otherwise be coupled in the same planar layer.
3Device complexity
If conventional coated electric wires are used, then the structure is simple, but the connection circuit cannot achieve miniaturization and thinness required for automotive applications
Solution Approach 1:
The patent employs a thin, flexible base material that can be folded to create multi-layered circuit structures. This thin-film approach enables miniaturization and thinness while maintaining electrical functionality, directly addressing the requirements for automotive applications where space is at a premium.
Solution Approach 2:
The patent achieves three-dimensionality by folding the thin base material, creating vertical circuit layers within a compact footprint. This dimensional transformation enables miniaturization and thinness without requiring complex rigid structures, achieving the desired size reduction while maintaining electrical performance.
Data Source
AI summary
A connection circuit includes a base material, and circuits printed on the base material with conductive ink, in which a part of the base material is folded; at least parts of the circuits are layered in a vertical direction in a plan view; and the base material is interposed between the circuits in the vertical direction.