Folded Resin Substrate Coil for High Inductance
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Solution Overview
Problem
Existing coil structures, particularly those with laminated insulating layers, face challenges in achieving high inductance and reliable connections due to complex via structures and limited number of turns, making them difficult to manufacture and maintain high connection reliability.
Innovation Solution
A coil design featuring a resin substrate with spiral-shaped coils on both surfaces, where the substrate is folded to oppose corresponding coils, allowing for easy manufacturing and high inductance through increased turns, and utilizing magnetic or adhesive sheets for enhanced performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If laminated insulating layers with conductor patterns are used to form a coil, then the coil structure is established, but the manufacturing complexity increases due to complex via structures and limited number of turns
Solution Approach 1:
The patent transitions from a planar laminated structure to a three-dimensional folded structure. The resin substrate is folded to form multiple layers, allowing coil patterns to be formed on both the front and back surfaces. This dimensional change enables the coil to achieve greater height and inductance without requiring complex via structures through multiple insulating layers, thereby simplifying manufacturing while maintaining structural integrity.
Solution Approach 2:
The coil structure is segmented into multiple sections formed on different surfaces of the folded resin substrate. The first and second coil patterns are formed on the front surface, while the third and fourth coil patterns are formed on the back surface. This segmentation allows each coil pattern to be independently formed and connected, reducing the overall manufacturing complexity compared to forming all connections through complex via structures in a laminated structure.
2Reliability
If laminated insulating layers are used to form a coil, then the coil structure is established, but the inductance is limited due to restricted number of turns
Solution Approach 1:
By folding the resin substrate to create a three-dimensional structure, the patent enables the formation of multiple coil turns in the vertical dimension. The folded structure allows coil patterns to extend across multiple layers and surfaces, significantly increasing the number of turns that can be accommodated within a compact footprint, thereby increasing inductance without compromising connection reliability.
Solution Approach 2:
The patent merges the formation of multiple coil patterns on both the front and back surfaces of the folded resin substrate into a single integrated structure. This combining approach allows all coil patterns to be formed simultaneously on the substrate before folding, ensuring reliable connections while achieving a high number of turns through the three-dimensional configuration.
3Reliability
If multiple insulating layers with via structures are used, then coil connections are established, but manufacturing difficulty increases
Solution Approach 1:
The patent eliminates the need for complex via structures by transitioning to a folded three-dimensional configuration. Connections between coil patterns are achieved through the folded resin substrate itself, which provides direct mechanical and electrical pathways between different surfaces. This approach maintains connection reliability while dramatically simplifying the manufacturing process, as it avoids the need to form and fill multiple via holes through stacked insulating layers.
Solution Approach 2:
The patent extracts and eliminates the complex via structures from the traditional laminated coil design. By using a folded resin substrate with coil patterns formed on both surfaces, the invention removes the need for via holes and multiple insulating layers, thereby simplifying manufacturing while maintaining reliable electrical connections through the folded substrate structure.
Data Source
AI summary
A coil includes a resin substrate, a first coil structure formed on a first surface of the resin substrate, a second coil structure formed on a second surface of the resin substrate on the opposite side with respect to the first surface such that the second coil structure is formed at a position corresponding to the first coil structure, a third coil structure formed on the second surface such that the third coil structure is positioned adjacent to the second coil structure, and a fourth coil structure formed on the first surface such that the fourth coil structure is formed at a position corresponding to the third coil structure. The resin substrate is folded such that the second coil structure and the third coil structure oppose each other.