Folded Planar RFID Antenna for Multi-Band Directivity
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Solution Overview
Problem
Conventional planar RFID devices face limitations in bandwidth, multi-band operation, and directivity, which restrict their performance and effectiveness in various applications.
Innovation Solution
The method involves folding a planar substrate with associated RFID components at defined fold lines to create a non-planar structure, enhancing bandwidth and directivity by optimizing the placement and orientation of antenna elements and using a dielectric spacer to achieve improved signal directionality and frequency range operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a planar substrate structure is used for RFID devices, then the device structure is simple and easy to manufacture, but the bandwidth and multi-frequency capabilities are limited
Solution Approach 1:
The patent transforms the traditional two-dimensional planar substrate into a three-dimensional non-planar structure by folding the substrate along defined fold lines. This dimensional change enables the antenna elements to be positioned at different spatial locations and orientations, thereby achieving extended bandwidth and multi-frequency capabilities while maintaining manufacturing simplicity through the folding process
2Ease of manufacture
If a planar substrate structure is used for RFID devices, then the manufacturing process is simple, but the directivity and signal gain in specific directions are insufficient
Solution Approach 1:
By folding the planar substrate into a non-planar configuration, the antenna elements are positioned at different three-dimensional coordinates with specific orientations. This spatial arrangement enables the RFID device to achieve enhanced directivity and signal gain in specific directions, while the folding manufacturing process remains relatively simple and can be integrated into existing production lines
3Adaptability or versatility
If the substrate is folded to create a non-planar structure, then bandwidth and directivity are improved, but the device complexity increases
Solution Approach 1:
The substrate is divided into multiple sections or panels that are folded along defined fold lines to form the non-planar structure. This segmentation approach allows the complex three-dimensional shape to be constructed from simpler planar components, making the manufacturing process more manageable and the structural transitions sharper and more defined
Solution Approach 2:
The folding process creates curved or angled surfaces in the non-planar structure, which are essential for achieving the desired antenna element orientations and spatial arrangements. These curved transitions between planar sections enable the structure to achieve improved bandwidth and directivity while maintaining manufacturability
Data Source
AI summary
An RFID device is provided with a substrate and a plurality of RFID components associated to the substrate. The substrate is initially provided in a substantially planar configuration, with the RFID components being associated to the substantially planar substrate. After the RFID components have been associated to the substrate, the substrate is folded at least one fold line to give the substrate and resulting RFID device a non-planar structure. All or portions of at least two of the RFID components are associated to portions of the substrate that are present in different planes, which may include portions of the substrate that are oriented in generally parallel planes or at an angle to each other. By such a non-planar, three-dimensional configuration, an RFID device may be provided with enhanced functionality, including increased bandwidth, ability to receive and radiate signals in a plurality of distinct frequency bands, and directivity.