3D Folded Thermal Interface Material for Multi-Elevation Heat Transfer
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Solution Overview
Problem
Modern computer systems face challenges in efficient heat management due to the need for quick and efficient heat removal from components with varying load requirements, often situated near other components that produce less heat, requiring sophisticated thermal interface solutions for effective heat transfer and distribution in three-dimensional spaces.
Innovation Solution
A three-dimensional thermal interface material (TIM) sheet with specific folds and configurations allows for precise placement and retention, providing a thermal interconnect between components at different elevations and load requirements, featuring high conductivity, compressibility, and gap filling capabilities, enabling continuous heat transfer and spreading.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional flat TIM sheets are used, then manufacturing is simple, but heat transfer efficiency between components at different elevations is insufficient
Solution Approach 1:
The patent transforms a traditional two-dimensional flat TIM sheet into a three-dimensional structure by folding it vertically. This dimensional change allows the TIM to bridge gaps between components at different elevations (e.g., CPU and heat sink separated by z-distance), enabling effective heat transfer in the vertical dimension while maintaining thermal contact across multiple planes simultaneously.
Solution Approach 2:
The folded TIM structure creates nested layers where multiple portions of the TIM sheet are stacked vertically. These nested layers allow the TIM to adapt to varying component elevations and gap heights, with each folded layer providing thermal conduction pathways through different vertical positions, effectively nesting thermal transfer paths within a single component.
2Reliability
If multiple separate TIM components are used for different components, then each component can be optimized, but assembly complexity and manufacturing difficulty increase
Solution Approach 1:
The patent merges multiple separate TIM components into a single integrated folded TIM sheet. This unified structure provides thermal interface functionality for multiple components (e.g., CPU, GPU, and other heat-generating elements) simultaneously, eliminating the need to install multiple separate TIM layers and reducing assembly steps while maintaining reliable thermal contact across all interfaces.
Solution Approach 2:
The folded TIM sheet serves multiple functions within a single component: it provides thermal conduction between different elevation levels, fills gaps of varying heights, accommodates multiple heat-generating components, and maintains thermal contact under compression. This multi-functionality allows one TIM structure to replace what would traditionally require several different TIM components.
3Area of stationary object
If TIM sheet surface area is increased for better heat spreading, then heat transfer improves, but gap filling capability for varying elevations becomes difficult
Solution Approach 1:
By folding the TIM sheet vertically, the patent increases the effective surface area available for heat spreading while simultaneously creating adaptability to different gap heights. The vertical folds allow the TIM to extend into the z-dimension, providing both large contact areas for heat transfer and variable thickness regions for gap filling across different elevations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The TIM sheet effectively directs heat across components with different load requirements, ensuring reliable thermal contact and efficient heat management by providing a larger surface area for heat transfer and gap filling, while being easily assembled and replaced.
Implementation Method 1
providing a thermal interconnect between a heat exchanger and/or a heat spreader plate and components at different elevations
Data Source
AI summary
A thermal interface material (TIM) structure for directing heat in a three-dimensional space including a TIM sheet. The TIM sheet includes a lower portion along a lower plane; a first side portion along a first side plane; a first upper portion along an upper plane; a first fold between the lower portion and the first side portion positioning the first side portion substantially perpendicular to the lower portion; and a second fold between the first side portion and the first upper portion positioning the first upper portion substantially perpendicular to the first side portion and substantially parallel to the lower portion.