Folded Wiring Substrate for Flexible Biometric Sensors
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Solution Overview
Problem
The reduction in thickness of wiring substrates for electronic devices to enhance flexibility compromises their mechanical strength, making handling during manufacturing challenging, especially when mounting electronic components on opposite surfaces.
Innovation Solution
A support body with a U-shaped cross-section and a flexible wiring substrate design where the wiring substrate is attached along the outer peripheral surface and folded inward, with light emitting and receiving elements mounted on the inner surfaces to face each other, enhancing mechanical strength and flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the thickness of the wiring substrate is decreased to increase flexibility, then the flexibility is improved, but the mechanical strength deteriorates
Solution Approach 1:
The wiring substrate is folded back along the inner peripheral surface of the support body, transforming from a linear two-dimensional layout to a three-dimensional folded structure. This allows the substrate to maintain thinness for flexibility while the folded configuration provides structural reinforcement and improved mechanical strength.
Solution Approach 2:
The wiring substrate is folded back and attached along the inner peripheral surface of the support body, creating a nested configuration where the substrate is positioned within the U-shaped structure. This nesting arrangement allows the thin substrate to gain structural support from the enclosing support body geometry.
2Adaptability or versatility
If the thickness of the wiring substrate is decreased to increase flexibility, then the flexibility is improved, but the handleability during manufacturing deteriorates
Solution Approach 1:
By folding the substrate into a three-dimensional configuration along the inner peripheral surface, the design transforms the handling challenge of thin flat substrates into a structurally supported folded form that is easier to manipulate and position during manufacturing processes.
Solution Approach 2:
The support body acts as an intermediary structure that provides a geometric framework for the thin wiring substrate. The U-shaped support body with its outer and inner peripheral surfaces creates a natural mounting structure that facilitates handling and assembly of the fragile thin substrate.
3Adaptability or versatility
If electronic components are mounted on opposite surfaces of a thin wiring substrate, then the device functionality is achieved, but the handling difficulty increases
Solution Approach 1:
The folded three-dimensional configuration allows components mounted on opposite surfaces of the thin substrate to be positioned in spatially separated locations along the inner peripheral surface, making them accessible for mounting and inspection while maintaining the thin substrate profile.
Solution Approach 2:
The nested configuration of the folded substrate within the U-shaped support body provides structural reinforcement that compensates for the thinness required for flexibility, enabling component mounting on opposite surfaces without compromising handleability during manufacturing.
Data Source
AI summary
An electronic device includes a support body, a wiring substrate, a light emitting element, and a light receiving element. The support body includes first and second planar portions facing each other, a connecting portion connecting basal ends of the planar portions, and a receptacle. The wiring substrate is attached along an outer peripheral surface of the support body, folded at a distal end of each planar portion, and attached along an inner peripheral surface of the planar portion. The light emitting element is mounted on a first surface of the wiring substrate at a portion attached along the inner peripheral surface of the first planar portion. The light receiving element is mounted on the first surface of the wiring substrate at a portion attached along the inner peripheral surface of the second planar portion so that the light receiving element faces the light emitting element.