Folding Display Sensing Sensor Stress Management

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Solution Overview

Problem

Existing electronic apparatuses with sensing sensors face challenges in maintaining reliability and folding performance due to stress-induced cracks in the sensing coils and cover layers during folding operations.

Innovation Solution

The electronic apparatus incorporates a sensing sensor design with a base layer, first and second sensing coils, and cover layers made of specific materials like polyimide and synthetic rubber, where the cover layers have a modulus less than the base layer, and an adhesive layer to reduce stress and prevent cracks during folding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a sensing sensor with rigid cover layers is used, then manufacturing precision and structural stability are improved, but folding performance deteriorates due to stress-induced cracks

Engineering Contradiction:
Improvestructural stabilityVSAvoidfolding performance
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The patent changes the material parameter (modulus) of the cover layer to be less than that of the base layer. This parameter change allows the cover layer to be more flexible and better withstand folding stresses, preventing cracks while maintaining structural stability during manufacturing and operation.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent uses composite material structure with at least two different materials for the base layer and cover layer. The base layer provides structural support while the cover layer with lower modulus provides flexibility and crack resistance during folding, achieving both manufacturing precision and folding performance.

Inventive Principle:
Principle #40Composite materials

2Strength

If adhesive layers are added to bond components, then structural integrity is improved, but device complexity increases

Engineering Contradiction:
Improvestructural integrityVSAvoidlayer structure
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The patent introduces an adhesive layer as an intermediary between the base layer and cover layer. This adhesive layer bonds the two structural layers together, improving structural integrity and preventing delamination during folding, while the bonding function is achieved through a single specialized layer rather than multiple complex mechanisms.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances the folding performance and reliability of the electronic apparatus by minimizing stress on the sensing sensor components, preventing cracks, and maintaining sensor functionality across folding cycles.

Implementation Method 1

the first cover layer has a modulus less than a modulus of the first base layer

Methodology Applied
Scientific EffectElasticity: Elasticity

Implementation Method 2

an adhesive layer disposed between the first base layer and the first cover layer to cover the first sensing coils, where the adhesive layer may bond the first base layer to the first cover layer

Methodology Applied
Scientific EffectAdhesion: Adhesive

Data Source

PatentUS11579741B2Electronic apparatus
Publication Date: 2023.02.14 SAMSUNG DISPLAY CO LTD
  • US11579741B2 patent drawing
  • US11579741B2 patent drawing
  • US11579741B2 patent drawing

AI summary

An electronic apparatus includes a display module divided into a first non-folding area, a folding area foldable along an imaginary folding axis extending in a second direction crossing a first direction, and a second non-folding area, which are sequentially arranged in the first direction, and a sensing sensor including a first base layer disposed under the display module, first sensing coils disposed on the first base layer, second sensing coils insulated from the first sensing coils, and a first cover layer disposed between the first sensing coils and the second sensing coils. The first cover layer has a modulus less than a modulus of the first base layer.