Folding Thermal Ground Plane With Wavy Stress-Relief Regions
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Solution Overview
Problem
Thermal management is a significant challenge for foldable electronic devices such as smartphones and AR/VR headsets, as they require effective heat dissipation while accommodating bending or folding mechanisms.
Innovation Solution
A thermal ground plane design comprising casings with folding and non-folding regions, incorporating a vapor structure and mesh with arteries, and wavy structures to facilitate flexible thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a rigid thermal ground plane is used, then thermal management performance is improved, but flexibility and foldability are lost
Solution Approach 1:
The patent employs flexible casings with wavy structures in the folding region that allow the thermal ground plane to bend and fold while maintaining structural integrity. The wavy pattern enables the rigid thermal management components to accommodate flexion without cracking or delamination, thus preserving both thermal performance and flexibility.
Solution Approach 2:
The thermal ground plane is divided into distinct regions: folding regions with wavy structures and non-folding regions with planar structures. This segmentation allows different parts of the device to have different mechanical properties - flexible where needed for folding, and rigid where needed for thermal management - resolving the contradiction between flexibility and thermal performance.
2Adaptability or versatility
If the casing is made flexible to enable folding, then adaptability is improved, but thermal management effectiveness deteriorates
Solution Approach 1:
The flexible casing incorporates wavy structures that maintain thermal contact between components during folding. The wavy pattern ensures that heat transfer paths remain intact even when the device is bent, preventing thermal management degradation while enabling foldability.
Solution Approach 2:
The casing transitions from a static rigid structure to a dynamic flexible structure with wavy patterns that adapt during folding. The wavy structure dynamically adjusts its shape during bending while maintaining continuous thermal contact, allowing the system to maintain thermal effectiveness across different states (folded and unfolded).
3Ease of manufacture
If a planar structure is used in the folding region, then manufacturing is simplified, but vapor flow blockage and stress concentration occur
Solution Approach 1:
The patent replaces planar folding regions with wavy structures featuring curved surfaces. These curved wavy patterns prevent stress concentration by distributing mechanical stress across the wave peaks and valleys, and simultaneously maintain vapor flow pathways open during folding, preventing blockage while improving reliability.
4Strength
If the bonding region overlaps with the folding region, then structural integrity is improved, but stress concentration and potential failure increase
Solution Approach 1:
The bonding region is designed with a wavy pattern instead of a straight line, creating curved bonding paths that distribute stress across multiple wave peaks and valleys. This wavy bonding structure reduces stress concentration at any single point while maintaining overall bonding integrity during folding cycles.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design allows for efficient heat dissipation and flexibility, maintaining thermal performance even during folding, reducing stress and preventing vapor flow blockage.
Implementation Method 1
The thermal ground plane may include a vapor structure... efficient heat dissipation... maintaining thermal performance even during folding
Implementation Method 2
The folding region of the first casing may have an out-of-plane wavy structure... reducing stress and preventing vapor flow blockage
Implementation Method 3
The mesh may include a plurality of arteries extending substantially parallel with a length of the thermal ground plane
Data Source
AI summary
Some embodiments include a thermal ground plane comprising a first and second casing with folding and non-folding regions. The thermal ground plane may also include a vapor structure and a mesh. The mesh may be disposed on an interior surface of the second casing and the mesh include a plurality of arteries extending substantially parallel with a length of the thermal ground plane. The folding region of the first casing may have an out-of-plane wavy structure. The valleys and peaks of the out-of-plane wavy structure, for example, may extend across a width of the first active region substantially parallel with a width of the thermal ground plane.