Folding Semiconductor Module Housing for Substrate Sealing
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Solution Overview
Problem
Existing power semiconductor module arrangements face challenges in achieving a satisfactory seal between the housing and the substrate, particularly in base plate-less configurations, which often require complex mechanical connections and additional sealing elements, increasing production costs and complexity.
Innovation Solution
A housing design featuring a plurality of side elements and hinge portions that fold around the substrate to form a closed frame, exerting pressure on the substrate's circumference, with optional sealing elements to enhance the seal, eliminating the need for mechanical connections and base plates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If additional mechanical connection elements (screws or rivets) are used to form a connection between the housing and the substrate or base plate, then the housing can be held together before curing of the sealing glue, but the device complexity and production cost increase
Solution Approach 1:
The invention extracts and eliminates the base plate from the semiconductor module structure. By removing this intermediate component, the housing can fold directly around the substrate, simplifying the overall structure while maintaining sealing reliability through the folding action that exerts pressure on the substrate circumference.
Solution Approach 2:
The housing transitions from a static structure to a dynamic folding structure. The folding side elements can move during assembly to wrap around the substrate, then lock into a stable closed frame configuration. This dynamic capability allows the housing to self-seal without additional mechanical fasteners.
2Strength
If a base plate is used to attach the housing by means of screws or rivets, then the housing can be mechanically connected to the substrate, but the quantity of components and assembly complexity increase
Solution Approach 1:
The invention merges the functions of the base plate and housing into a single integrated folding housing structure. The housing itself performs both the protective enclosure function and the mechanical attachment function by folding around and pressing against the substrate, eliminating the need for separate base plates and mechanical fasteners.
Solution Approach 2:
The folding housing structure is self-sufficient, creating its own mechanical connection through the folding action. The weight and pressure of the closed housing frame automatically exert sufficient force on the substrate to maintain the seal without requiring additional fasteners or a separate base plate for structural support.
3Device complexity
If the housing is glued directly to the substrate without mechanical connections, then the assembly is simplified, but the sealing of the housing becomes insufficient
Solution Approach 1:
The housing employs a dynamic folding mechanism that allows it to wrap around the substrate during assembly. This folding action creates a mechanical interlock and exerts circumferential pressure on the substrate, enhancing the seal beyond what simple gluing can achieve, while maintaining assembly simplicity.
Solution Approach 2:
The folding housing acts as a flexible shell during assembly, conforming to the substrate shape and creating a tight seal through its folding action. Once assembled, it forms a rigid closed frame that maintains sealing pressure without requiring additional mechanical fasteners.
Data Source
Figure 1~2
Figure 3~4C
Figure 5~6C
AI summary
A housing for a semiconductor module comprises a first plurality n of side elements, and a second plurality m of hinge portions, wherein n = m + 1, in an unassembled state of the housing, the side elements are arranged successively in one row and each of the hinge portions is arranged to connect two directly neighboring side elements, each of the side elements is foldable with respect to at least one other side element about a respective folding axis, and the side elements are configured to form a closed frame in an assembled state of the housing.