Footed Sleeve Assembly for Stable Pin Position in Electronic Modules
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Solution Overview
Problem
Existing electronic module designs face issues with sleeves moving during welding, leading to variations in pin position and instability.
Innovation Solution
An electronic module design featuring a connection track with a complementary footed sleeve fixed by conductive bonding, a deformable second end, and a mold with complementary protrusions to stabilize the sleeve during overmolding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If sleeves are force-fitted into connection tracks and then welded, then the electrical pins are held securely above the electronic module, but the sleeves are likely to move during welding causing variation in their position
Solution Approach 1:
The patent applies preliminary action by first inserting the foot of the sleeve into the opening of the connection track before welding. This preliminary positioning ensures that the sleeve is correctly located and constrained in the opening prior to the welding operation, preventing movement during welding and thereby eliminating position variation while maintaining secure holding of electrical pins.
2Ease of operation
If the second end of the sleeve is left open, then electrical pins can be inserted, but resin can intrude into the sleeve during overmolding
Solution Approach 1:
The patent applies dynamics by making the second end of the sleeve deformable rather than rigid. The second end is designed to be compressed by a mold during overmolding, allowing it to dynamically change shape from an open state (permitting pin insertion) to a closed state (preventing resin intrusion). This dynamic adaptation resolves the contradiction between ease of pin insertion and prevention of resin contamination.
3Object-affected harmful factors
If a mold with protrusions is used to compress the sleeve during overmolding, then resin intrusion is prevented, but additional manufacturing steps are required
Solution Approach 1:
The patent applies merging by combining the sleeve-closing function with the existing overmolding process. The mold used for overmolding is integrated with protrusions that simultaneously compress the second end of the sleeve to close it while injecting resin. This merging of functions eliminates the need for separate sleeve-closing operations, preventing resin intrusion without significantly increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design stabilizes sleeve position during welding, preventing resin intrusion and ensuring consistent pin placement, enhancing manufacturing precision and reliability.
Implementation Method 1
the sleeve is fixed by at least one means taken from electrically conductive bonding, welding or brazing
Implementation Method 2
the sleeve is fixed by at least one means taken from electrically conductive bonding, welding or brazing
Implementation Method 3
said second end of the sleeve being deformable by compression
Implementation Method 4
deforming, by compression, the second end of the sleeve using the at least one protrusion of the mold
Data Source
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AI summary
The invention relates to an electronic module (1) comprising: a connection track (11) having at least one opening (115), a sleeve (12) fixed in an electrically conductive manner to the connection track (11), said sleeve (12) comprising a first end having a foot (121) with a cross-section of shape complementary to that of the opening (115) in the connection track (11), said foot (121) being housed in the opening (115) of the connection track (11). The invention also relates to an associated mold and a method for manufacturing an electronic module (1).