Under-Seat Footwell Heating Module With PCB Cooling Airflow
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Solution Overview
Problem
Conventional liquid-coolant-based HVAC systems in vehicles are bulky, costly, and complex, and do not efficiently provide heat in hybrid and fully electric vehicles, while electrically powered heating elements face challenges with heat management and packaging space constraints.
Innovation Solution
A compact heating module with a housing containing a discrete printed circuit board assembly and heating element portion, where airflow is separately managed to prevent heat absorption by the PCB, and an air temperature sensor is used to control the heating elements and airflow, allowing for efficient heat distribution and reduced packaging size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid coolant systems are used for heating, then heating capability is improved, but packaging space and system complexity increase
Solution Approach 1:
The patent replaces the liquid coolant-based mechanical heating system with an electric heating element system. The heating element directly converts electrical energy to thermal energy, eliminating the need for coolant lines, pumps, and heater cores, thereby significantly reducing packaging space while maintaining heating capability.
Solution Approach 2:
The patent extracts and eliminates the coolant system components (coolant lines, heater core, pump) from the heating system, retaining only the essential heating function through an electric heating element integrated with a compact housing and airflow path.
2Volume of stationary object
If PCBAs are located proximate to heating elements to reduce packaging space, then packaging space is reduced, but heat absorption by PCBA increases
Solution Approach 1:
The patent introduces an airflow path as an intermediary between the heating element and PCBA. This airflow serves as a thermal mediator that carries heat away from the PCBA while allowing the components to remain in close proximity for compact packaging. The housing design directs airflow to specifically protect the PCBA from excessive heat.
Solution Approach 2:
The patent applies different thermal management strategies to different parts of the system. The housing design creates localized airflow zones: one zone directs air over the heating element for heat generation, while another zone directs cooled air specifically over the PCBA to prevent heat absorption, allowing each component to operate in its optimal thermal environment.
3Ease of operation
If conventional HVAC units are used for leg conditioning, then heating function is provided, but packaging space requirements are not met
Solution Approach 1:
The patent segments the HVAC system into a compact, modular unit designed specifically for leg conditioning. The housing integrates the heating element, airflow path, and control components into a single compact module that fits under the vehicle seat, separating it from the main HVAC system and optimizing it for the specific application of footwell heating.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides effective heat management and reduced packaging size, enabling the heating module to fit under vehicle seats and efficiently condition occupant's legs, while protecting the PCB from heat and ensuring accurate temperature sensing.
Implementation Method 1
an electrically powered heating element
Implementation Method 2
airflow is provided to the printed circuit board assembly by a fluid moving device
Data Source
AI summary
A heating module and a vehicle and vehicle seat comprising the same. The heating module comprises a housing and a printed circuit board assembly. The housing comprises a printed circuit board assembly portion and a heating element portion. The printed circuit board assembly is located within the printed circuit board assembly portion. One or more heating elements are located within the heating element portion. An airflow is provided to the printed circuit board assembly portion by a fluid moving device to draw heat from the printed circuit board assembly.