Multi-Chip Packaging Layout for FOPLP Displacement Control

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Solution Overview

Problem

Fan-out panel level packaging (FOPLP) processes face challenges with chip displacement, leading to yield loss, especially in multi-chip or advanced 2.5D/3D heterogeneous integration designs, where large displacements result in scrapped products.

Innovation Solution

Incorporating spacing elements and alignment marks in the packaging process to control chip displacement, with a ratio of distance to width between elements ranging from 1 to 1.3, allowing for improved alignment and reduced displacement during bonding and molding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If chip displacement is not controlled during molding, then manufacturing process is simple, but packaging yield decreases due to scrapped products

Engineering Contradiction:

Improvepackaging yieldVSAvoidprocess complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

Alignment marks are formed on the substrate before chip mounting and molding processes. These pre-formed marks enable precise measurement and compensation of chip displacement during subsequent manufacturing steps, allowing yield improvement without fundamentally changing the molding process itself

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

Alignment marks serve as an intermediary reference system between the substrate and chips. By providing visible markers that can be detected and used for measurement, they mediate the displacement control function without requiring direct modification of the chips or substrate structure

Inventive Principle:

Principle #24Intermediary (Mediator)

2Measurement precision

If substrate engraving is used for alignment marks, then alignment precision improves, but manufacturing cost increases

Engineering Contradiction:

Improvealignment precisionVSAvoidmanufacturing cost

Core Design Contradiction:

Measurement precisionVSEase of manufacture

Solution Approach 1:

The alignment marks are formed using a inexpensive photoresist layer that can be easily deposited and removed, replacing the need for costly substrate engraving. The photoresist marks serve their alignment purpose effectively without requiring permanent modification of the substrate

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The mechanical substrate engraving process is replaced with a chemical/photochemical process using photoresist material deposition and patterning. This substitution uses material deposition rather than mechanical removal, significantly reducing manufacturing complexity and cost

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Data Source

PatentUS12444691B2Electronic device and method of manufacturing the same

Publication Date: 2025.10.14 INNOLUX CORP

AI summary

An electronic device is provided. The electronic device includes a plurality of spacing elements, a first electronic unit and a second electronic unit, a protective layer and a connecting member. The first electronic unit and the second electronic unit are individually disposed between two adjacent spacing elements. The protective layer surrounds the spacing elements, the first electronic unit and the second electronic unit. The first electronic unit is electrically connected to the second electronic unit via the connecting member. In a direction that is perpendicular to a normal direction of the electronic device, the first electronic unit has a first width, and a first distance is between the two adjacent spacing elements. A ratio of the first distance to the first width is greater than or equal to 1 and less than or equal to 1.3. A method of manufacturing an electronic device is also provided.