FOPLP ToF Module Packaging for Compact AR/VR Depth Sensing
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Solution Overview
Problem
Traditional Time of Flight (ToF) modules have limitations in terms of size and complexity, requiring substrates, surface mounting, and multiple processing steps, which hinder their compactness and efficiency in applications like augmented and virtual reality.
Innovation Solution
The implementation of semiconductor Fan-Out Panel Level Packaging (FOPLP) technology for ToF modules, which embeds components in epoxy mold compounds without substrates, uses integrated optics, and employs better thermal management with conductive slugs, reducing the module footprint by up to 50% and simplifying the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If traditional substrate-based packaging is used, then components can be mounted and connected, but the module footprint becomes large and manufacturing complexity increases
Solution Approach 1:
The patent removes the traditional substrate from the packaging structure, extracting the mounting function to the panel itself. Components are mounted directly on the panel using redistribution layers, eliminating the need for separate substrates and reducing overall module footprint while simplifying manufacturing steps.
Solution Approach 2:
The patent transitions from 2D substrate-based mounting to 3D vertical stacking with redistribution layers at multiple levels. Components are arranged in different planes and connected through vertical vias and redistribution layers, enabling compact integration without increasing footprint area.
2Ease of manufacture
If multiple processing steps including surface mounting are used, then components can be assembled, but manufacturing time and cost increase
Solution Approach 1:
The patent combines multiple discrete manufacturing steps into integrated processes. The redistribution layers are formed directly on the panel during the same fabrication sequence used for creating the panel itself, merging substrate preparation, component mounting, and interconnection formation into a unified manufacturing flow.
Solution Approach 2:
The redistribution layers and connection structures are prepared in advance on the panel before components are mounted. This preliminary preparation of interconnection paths enables direct component attachment without subsequent complex routing or wiring steps, reducing overall manufacturing cycle time.
3Temperature
If conventional packaging with substrates is used, then components can be connected, but thermal management becomes less efficient
Solution Approach 1:
The patent introduces thermally conductive adhesive layers as intermediary materials between components and the panel, and between redistribution layers and components. These adhesive layers serve dual functions of electrical connection and thermal conduction, efficiently transferring heat from high-power components to the panel's thermal management structures.
Solution Approach 2:
The panel serves multiple functions simultaneously: it provides mechanical support, electrical interconnection through redistribution layers, and thermal management through integrated heat dissipation structures. This multi-functionality eliminates the need for separate substrate and heat sink components, reducing packaging complexity while improving thermal efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a significantly smaller, more cost-effective, and thermally efficient ToF module that can be integrated into various devices, enhancing their performance and usability in applications such as AR and VR.
Implementation Method 1
employs better thermal management with conductive slugs
Data Source
AI summary
This disclosure describes a Time of Flight (ToF) device leveraging semiconductor Fan-Out Panel Level Packaging (FOPLP) technology. The ToF device comprises a laser, a transmit optical assembly (TxO), a receive optical assembly (RxO), and a time of flight (ToF) sensor. The laser and the ToF sensor are embedded in a first compound. The TxO and the RxO are embedded in second compound that is different than the first compound.