Force-Adjustable Glue Transfer Head for Micro Device Handling
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Solution Overview
Problem
Traditional micro device transfer methods, such as direct and indirect bonding, are inefficient and require multiple bonding/de-bonding steps, which can be complex and costly, especially when handling small micro devices.
Innovation Solution
A method involving a carrier substrate with an adhesive layer, a force-adjustable glue layer on a transfer head, and a receiving substrate with a liquid layer, where the micro device is picked up, gripped by capillary force, and transferred using adjustable grip forces to detach and stick it to the receiving substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional direct bonding or indirect bonding methods are used to transfer micro devices, then the transfer process can be completed, but the process becomes complex and requires multiple bonding/de-bonding steps
Solution Approach 1:
The patent introduces a transfer head with a force-adjustable glue layer as an intermediary component between the carrier substrate and receiving substrate. This transfer head temporarily holds the micro device and facilitates its transfer without requiring direct bonding between the carrier and receiving substrates, thereby simplifying the overall process by eliminating the need for complex multiple bonding and de-bonding steps while ensuring reliable transfer completion
2Reliability
If traditional bonding methods are used for micro device transfer, then the transfer can be achieved, but the handling of small micro devices becomes inefficient and costly
Solution Approach 1:
The patent employs a force-adjustable glue layer on the transfer head that can dynamically adjust its adhesive properties. This dynamic adjustment allows the transfer head to effectively handle small micro devices by optimizing the grip force during pickup and transfer, thereby improving handling efficiency and productivity while ensuring reliable transfer achievement without the inefficiencies and costs associated with traditional bonding methods
3Reliability
If traditional bonding methods are used, then micro devices can be transferred, but multiple bonding/de-bonding steps are required which increases cost
Solution Approach 1:
The transfer head with force-adjustable glue layer serves as a reusable intermediary tool that eliminates the need for multiple bonding and de-bonding steps between carrier and receiving substrates. By using this single transfer head for pickup, transfer, and release operations, the manufacturing process is simplified, reducing both the complexity and cost of micro device transfer while maintaining reliable transfer completion
Solution Approach 2:
The force-adjustable glue layer allows for parameter changes in adhesive force during the transfer process. This capability enables the same transfer head to effectively perform multiple operations (pickup, transfer, release) by adjusting the glue layer's adhesive properties, thereby eliminating the need for multiple separate bonding and de-bonding steps and reducing manufacturing costs
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the transfer process, enhances yield, and reduces costs by using an adhesive type transfer head with adjustable grip forces, allowing for precise handling and bonding of micro devices without complex circuit designs.
Implementation Method 1
picking up the micro-device from the carrier substrate by a transfer head comprising a force-adjustable glue layer thereon via attaching the force-adjustable glue layer to the micro device and gripping the micro device by a grip force exerted by the force-adjustable glue layer
Implementation Method 2
placing the micro device over the receiving substrate by the transfer head such that the micro device is in contact with the liquid layer and is gripped by a capillary force
Implementation Method 3
an adhesive layer is between and in contact with the carrier substrate and the micro device
Data Source
AI summary
A method for transferring a micro device includes: preparing a carrier substrate with the micro device thereon in which an adhesive layer is present between and in contact with the carrier substrate and the micro device; picking up the micro-device from the carrier substrate by a transfer head comprising a force-adjustable glue layer thereon; forming a liquid layer on a receiving substrate; reducing the grip force of the force-adjustable glue layer of the transfer head to be smaller than a force attaching the micro device to the receiving substrate; placing the micro device over the receiving substrate such that the micro device is in contact with the liquid layer and is gripped by a capillary force; and moving the transfer head away from the receiving substrate such that the micro device is detached from the transfer head and is stuck to the receiving substrate.