Force Balanced Chip Package Mounting for Thermal Stress Management
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Solution Overview
Problem
Current force balancing techniques for mounting chip packages to printed circuit boards in massive-element antenna assemblies fail to manage stress effectively, leading to solder connection and routing failures due to excessive force transmission from thermal management systems.
Innovation Solution
The use of separate biasing members to control forces applied to thermal management systems and thermal spreaders, allowing independent adjustment of forces to balance the total forces applied to chip packages and printed circuit boards, thereby reducing stress and enhancing reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a thermal management system is used to dissipate heat from IC dies, then thermal management capability is improved, but stress on solder connections and PCB increases due to large combined forces
Solution Approach 1:
The patent divides the force control function into two separate biasing members: a first biasing member that applies force between the thermal spreader and PCB, and a second biasing member that applies force between the thermal management system and thermal spreader. This segmentation allows independent optimization of thermal contact force without excessively stressing the PCB and solder connections.
Solution Approach 2:
The patent changes the force application parameters by using separate biasing members with different force magnitudes. The first biasing member provides a controlled force (e.g., 1-10 pounds) to ensure thermal contact, while the second biasing member provides additional force (e.g., 10-50 pounds) for thermal management system contact, allowing the total force to be distributed and managed separately from the contact forces.
2Temperature
If larger thermal management systems are used to handle increased heat load, then thermal dissipation capability is improved, but device complexity and size increase
Solution Approach 1:
The patent segments the thermal management system into distinct functional components: a thermal spreader for heat distribution, and a thermal management system for heat dissipation. Each component has its own biasing member, allowing independent optimization and simplifying the overall system design and assembly.
Solution Approach 2:
The thermal spreader serves multiple functions: it distributes heat from the IC die, provides a mounting surface for the thermal management system, and maintains thermal contact through the first biasing member. This multi-functionality reduces the need for additional components, simplifying the overall system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively manages stress within electronic devices, promoting increased reliability and performance by allowing efficient thermal management, enabling compact and robust antenna designs for next-generation mobile communication devices with ultra-high speed and low latency.
Implementation Method 1
The first biasing member is configured to control a first force sandwiching the chip package between the thermal spreader and the PCB
Implementation Method 2
the thermal spreader and cooling plate, and the force utilized to ensure good thermal contact between the thermal spreader and IC die of the chip package
Data Source
AI summary
An electronic device is provided that balances the force applied to temperature control elements such that stress within components of the electronic device can be effectively managed. In one example, an electronic device is provided that includes a printed circuit board (PCB), a chip package, a thermal management system, a thermal spreader, and first and second biasing members. The chip package is mounted to the PCB. The thermal management system and spreader are disposed the opposite of the chip package relative to the PCB. The first biasing member is configured to control a first force sandwiching the chip package between the thermal spreader and the PCB. The second biasing member is configured to control a second force applied by the thermal management system against the thermal spreader. The first force can be adjusted separately from the second force so that total forces applied to the chip package and PCB may be effectively balanced.