Force-Haptic Sensor Chip Latency Reduction
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Solution Overview
Problem
Conventional force sensing buttons lack natural haptic feedback due to processing latency when sensor signals are processed through an application processor before initiating haptic excitation, affecting user experience in applications like mobile, automotive, and industrial sectors.
Innovation Solution
Integrated systems with force or strain sensing, force level calibration, and haptic excitation functionalities, where haptic feedback logic is implemented on a sensor chip, reducing latency by processing signals locally and generating excitation signals directly, using force sensors or strain gauges with piezoelectric or other haptic actuators.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If sensor signals are processed through an application processor before initiating haptic excitation, then the system architecture is simplified and easier to manufacture, but system latency increases and user experience deteriorates
Solution Approach 1:
The patent merges the force sensing element, signal processing circuitry, and haptic actuator into a single integrated sensor chip. This consolidation eliminates the need for separate application processor communication, thereby reducing system latency while maintaining manufacturing simplicity through monolithic integration.
Solution Approach 2:
The sensor chip acts as an intermediary between the force application and haptic feedback system. It locally processes sensor signals and directly controls the haptic actuator, serving as a self-contained unit that mediates the feedback loop without requiring external processor intervention, thus reducing latency.
2Adaptability or versatility
If mechanical buttons are removed to achieve a single sensing surface, then device integration and water/moisture proofing are improved, but natural haptic feedback is eliminated
Solution Approach 1:
The patent replaces traditional mechanical buttons with a force sensing button that uses piezoelectric or capacitive sensing elements. This substitution eliminates mechanical moving parts, enabling a seamless single sensing surface that maintains water and moisture proofing while providing tactile feedback through haptic actuation.
Solution Approach 2:
The patent incorporates a haptic actuator that generates mechanical vibrations to simulate the tactile sensation of pressing a button. This vibration-based feedback mechanism restores natural haptic feedback to users while maintaining the benefits of a buttonless single sensing surface design.
3Loss of time
If full haptic feedback logic is implemented on the sensor chip, then system latency is reduced and user experience is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The sensor chip is designed to perform multiple functions: force sensing, signal conditioning, threshold detection, calibration, and haptic actuator control. This multi-functionality consolidates what would traditionally require separate components, reducing latency while managing complexity through integrated design.
Solution Approach 2:
The sensor chip is designed to be self-sufficient, containing all necessary circuitry for signal processing and haptic control within the same chip. This self-service capability eliminates dependencies on external processors, reducing latency while the modular chip design keeps manufacturing complexity manageable.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces system latency and enhances user experience by providing immediate and accurate haptic feedback, improving the functionality of force sensing buttons in various applications.
Implementation Method 1
The sensor chip can include at least one sensing element and an integrated circuit
Implementation Method 2
the at least one sensing element can be a force sensor or a strain gauge sensor
Implementation Method 3
the haptic actuator can be a piezoelectric haptic actuator. The piezoelectric haptic actuator can include a bulk piezoelectric substrate
Data Source
AI summary
Integrated systems for force or strain sensing and haptic feedback are described herein. An example force-haptic system can include a sensor chip configured to receive an applied force, where the sensor chip includes at least one sensing element and an integrated circuit. The force-haptic system can also include a haptic actuator configured to convert an electrical excitation signal into mechanical vibration. Further, the force-haptic system can include a circuit board, where the sensor chip and the haptic actuator are electrically and mechanically coupled to the circuit board. The integrated circuit can be configured to process an electrical signal received from the at least one sensing element and to output the electrical excitation signal.