Force Key Sensor Assembly Without Adhesive
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Solution Overview
Problem
The existing force key structures in electronic devices face issues due to adhesive materials that are affected by temperature changes, leading to inconsistent sensor performance and difficulty in maintaining a strong adhesive force over time, and the process of attaching sensors to the housing can be complex and challenging for maintenance.
Innovation Solution
A force key structure is designed without a separate adhesive material, featuring a sensor assembly press-fit between the sidewall structure and an internal frame, where the sensor is aligned with the key area and supported by a support member, allowing it to sense force based on displacement of the inner surface, eliminating the need for external adhesives and simplifying the attachment process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive material is used to attach the sensor to the housing, then the sensor can be firmly attached, but the adhesive performance varies with temperature changes and degrades over time
Solution Approach 1:
The patent removes the adhesive material from the sensor attachment system entirely. The sensor is instead directly integrated with the housing structure through mechanical coupling, eliminating the temperature-sensitive adhesive layer that caused performance variability and degradation over time.
Solution Approach 2:
The patent introduces a support member as an intermediary component between the sensor and the housing. This support member provides stable mechanical support and positioning for the sensor without relying on temperature-sensitive adhesive materials, ensuring consistent sensor performance across varying temperatures.
2Stability of the object's composition
If adhesive material is used to attach the sensor, then the sensor can be fixed in place, but the attachment process becomes complex and maintenance becomes difficult
Solution Approach 1:
The patent eliminates the adhesive attachment process entirely by using direct mechanical coupling between the sensor, support member, and housing. This simplifies manufacturing by removing the adhesive application, curing, and quality inspection steps while enabling easier sensor replacement and maintenance.
Solution Approach 2:
The support member is designed to automatically position and secure the sensor through its structural integration with the housing, eliminating the need for external adhesive materials and complex attachment procedures. The mechanical coupling structure provides self-aligning and self-securing functionality.
3Ease of manufacture
If adhesive material is used for sensor attachment, then the sensor can be mounted on the housing, but foreign matter can infiltrate through the opening
Solution Approach 1:
The patent removes the opening in the housing that was necessary for sensor attachment with adhesive. The sensor is instead integrated through the existing structural openings designed for force detection, eliminating the pathway for foreign matter infiltration while maintaining sensor mounting functionality.
Solution Approach 2:
The support member acts as an intermediary that bridges the sensor to the housing structure without requiring additional openings. It routes the sensor integration through the existing force-detection openings in a sealed manner, preventing foreign matter infiltration while enabling sensor mounting.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures consistent sensor performance across varying temperatures and provides a robust attachment method that maintains sensor functionality over time, preventing foreign matter infiltration and simplifying maintenance by eliminating the reliance on temperature-sensitive adhesives.
Implementation Method 1
a sensor configured to sense a force applied to the key area, based on displacement of an inner surface of the key area
Data Source
AI summary
Disclosed is an electronic device. The electronic device includes a sidewall structure that forms a surface of the electronic device and that includes a key area formed on the surface of the electronic device. The electronic device also includes an internal frame that is formed inside the electronic device and faces an inner surface of the sidewall structure. The electronic device further includes a sensor assembly disposed between the internal frame and the sidewall structure, at least part of the sensor assembly is aligned with the key area. The sensor assembly includes a sensor that senses a force applied to the key area, based on displacement of an inner surface of the key area. The sensor assembly also includes a support member having one surface supported on the sensor and an opposite surface supported on the internal frame.