Three Layer Force Pad Sensor Vertical Electrode Stacking
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Solution Overview
Problem
Existing force pad technologies face challenges in achieving a thin and accurate design while maintaining effective proximity and force detection capabilities, which are essential for modern electronic systems.
Innovation Solution
The implementation of a force pad sensor with a face sheet, a proximity sensor layer, and a force sensor layer, where the force receiver electrode, force sensing resistor, and floating electrode intersect a common vertical plane, allowing for a thin and accurate force pad design that combines proximity and force detection capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a force pad uses traditional multi-layer electrode structures, then it achieves force and proximity detection capabilities, but the device thickness increases and manufacturing complexity increases
Solution Approach 1:
The patent transitions from traditional planar electrode arrangements to a vertical stacking architecture where transmitter and receiver electrodes are positioned in different layers along the vertical dimension. This dimensional reorganization enables thin-profile force and proximity sensing while maintaining detection accuracy through the vertical separation of electrode functions.
Solution Approach 2:
The force sensor layer and proximity sensor layer are nested within each other in a vertically stacked configuration. The proximity sensor layer contains transmitter and receiver electrodes that are vertically aligned, with the force sensing resistor positioned between them. This nesting enables multiple sensing functions within a compact thickness.
2Adaptability or versatility
If a force pad uses traditional electrode configurations, then it provides sensing functionality, but the number of layers and manufacturing steps increases
Solution Approach 1:
The vertically aligned transmitter and receiver electrodes serve dual purposes: they function as capacitive sensors for proximity detection and as force sensing elements when combined with the force sensing resistor. This multi-functionality reduces the need for separate electrode structures for different sensing modes, simplifying the overall device architecture.
Solution Approach 2:
The patent combines the force sensing resistor with the capacitive sensing electrodes in a unified vertical stack. The force sensing resistor is positioned between the transmitter and receiver electrodes, merging force detection and proximity detection into a single integrated structure rather than requiring separate sensing elements.
3Length of stationary object
If a force pad reduces thickness to meet design constraints, then it satisfies form factor requirements, but detection precision may deteriorate
Solution Approach 1:
By transitioning to vertical stacking, the patent achieves thin-profile design (satisfying thickness constraints) while maintaining detection precision through the vertical separation of sensing functions. The vertical arrangement allows adequate electrode spacing for accurate capacitance measurement without increasing the horizontal footprint or overall device thickness.
4Length of stationary object
If a force pad uses vertically aligned electrodes, then it achieves thin-profile design, but electrode alignment precision requirements increase
Solution Approach 1:
The nested vertical stacking arrangement positions the force sensing resistor, transmitter electrodes, and receiver electrodes in a compact vertical sequence. This nesting consolidates alignment requirements into a single vertical registration process rather than requiring complex lateral alignment of multiple planar layers, simplifying manufacturing despite the vertical configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables improved usability and thickness constraints satisfaction by allowing for precise detection of input objects and applied forces, enhancing the overall performance of electronic systems.
Implementation Method 1
a force pad includes a face sheet, a proximity sensor layer, and a force sensor layer. The face sheet includes a mylar layer, and conductive ink and a force sensing resister (FSR) printed on the mylar layer.
Implementation Method 2
The proximity sensor layer includes a proximity receiver electrode and a proximity transmitter electrode
Implementation Method 3
The force sensor layer includes a force receiver electrode and a force transmitter electrode. The force receiver electrode and the FSR intersect a same vertical plane
Data Source
AI summary
A force pad sensor includes a face sheet including a force sensing resister, and a printed circuit board assembly. The printed circuit board assembly includes a proximity sensor layer including a proximity receiver electrode and a proximity transmitter electrode, and a force sensor layer including a force receiver electrode and a force transmitter electrode. The force receiver electrode and the FSR intersect a same vertical plane, the vertical plane being perpendicular to the face sheet.