Force Sensor Chip Temperature Compensation via Resistance Element Layout
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Solution Overview
Problem
Existing force sensor chips face challenges in achieving accurate temperature compensation and balanced output across axes due to irregular initial resistance values and temperature-dependent strain sensitivity, particularly when using semiconductor substrates, where crystal orientation and heat transfer characteristics are not adequately considered.
Innovation Solution
The force sensor chip design includes temperature-compensating resistance elements placed in non-deforming regions with the same peripheral structure as strain resistance elements, ensuring they are equally affected by temperature and stress, and initial resistance values are optimized based on crystal orientation to balance outputs across axes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If temperature-compensating resistance elements are provided in non-deforming regions, then temperature compensation is achieved, but the initial resistance values become irregular and output balance across axes deteriorates
Solution Approach 1:
The patent applies local quality by giving different initial resistance values to strain resistance elements based on their specific locations and the crystal orientation of the semiconductor substrate. This allows each element to be optimized for its local conditions, achieving both temperature compensation and output balance across different axes simultaneously.
Solution Approach 2:
The patent changes the parameter of initial resistance values from uniform to varied based on crystal orientation. By adjusting resistance values according to the directional properties of the semiconductor substrate, the patent achieves balanced output across axes while maintaining temperature compensation functionality.
2Measurement precision
If strain resistance elements are disposed on connecting parts with deformation, then stress detection capability is improved, but temperature-dependent resistance variation increases
Solution Approach 1:
The patent introduces temperature-compensating resistance elements as intermediary components that experience the same temperature variations as the strain resistance elements. These compensating elements provide reference data that allows the system to separate temperature effects from stress effects, enabling accurate stress detection despite temperature-dependent resistance variations.
Solution Approach 2:
The patent segments the resistance measurement function into two separate components: strain resistance elements for stress detection and temperature-compensating resistance elements for temperature reference. This segmentation allows independent optimization of each function while maintaining their interrelationship through the bridge circuit.
3Manufacturing precision
If crystal orientation is considered for resistance element disposition, then output balance across axes is improved, but device complexity increases
Solution Approach 1:
The patent applies asymmetry by deliberately configuring resistance elements with different initial resistance values according to the crystal orientation of the semiconductor substrate. This asymmetric configuration, rather than uniform placement, achieves balanced output across axes by compensating for the inherent anisotropic properties of the crystal structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design allows for high-accuracy temperature compensation and stress detection, ensuring that the force sensor chip provides balanced and accurate output values by harmonizing resistance values and heat transfer conditions between strain and temperature-compensating resistance elements.
Implementation Method 1
The strain resistance elements are affected by the stress generated in response to the force or moment applied to an operating part of the semiconductor substrate, and the resistance values change
Implementation Method 2
The variation characteristics of the resistance values of the strain resistance elements are inherently temperature-dependent, and the corresponding temperature-compensating resistance elements and the stress resistance elements are therefore equally affected by temperature
Data Source
AI summary
A force sensor chip including a semiconductor substrate having a plurality of strain resistance elements and temperature-compensating resistance elements corresponding to the resistance elements is disclosed. The structure in the periphery of parts where the strain resistance elements, which are provided to deforming parts in the action part formed on the semiconductor substrate, are disposed is the same as the structure in the periphery of parts where the temperature-compensating resistance elements in the action part are disposed.