Force Sensor Chip Thin Area Design for Detection Balance
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Solution Overview
Problem
Existing six-axis force sensors face challenges in maintaining detection balance between axial forces when the semiconductor substrate is made more compact, leading to potential warping, cracking, and stress concentration issues, which affect detection sensitivity and accuracy.
Innovation Solution
A force sensor chip design with a thin area formed in the base member, including the connecting parts, to increase the overall degree of deformation and maintain detection balance, while preventing stress concentration by forming boundaries of the thin area in the supporting and operating parts, thereby enhancing sensitivity and reducing design errors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the semiconductor substrate is made more compact to reduce device size, then the chip area is reduced, but the detection balance between axial forces deteriorates and stress concentration occurs
Solution Approach 1:
The patent applies local quality by creating a thin area with reduced thickness specifically in the connecting parts region of the semiconductor substrate. This localized thinning increases the degree of deformation in the connecting parts, thereby maintaining detection balance between axial forces even when the overall chip area is reduced. The thin area is positioned to include the connecting parts while keeping boundaries in the supporting and operating parts, ensuring optimal stress distribution.
2Area of stationary object
If the semiconductor substrate is made more compact, then the device size is reduced, but the chip may warp or crack due to stress concentration
Solution Approach 1:
The patent creates a localized thin area in the connecting parts region to redistribute stress. By reducing the thickness specifically in this region while maintaining full thickness in other areas, the design prevents stress concentration that would lead to warping or cracking, thereby maintaining chip integrity during compactification.
Solution Approach 2:
The substrate is effectively segmented into different thickness regions: a thin area including the connecting parts and thicker regions in the supporting and operating parts. This segmentation allows different parts of the chip to have different mechanical properties optimized for their specific functions, preventing overall structural failure while enabling compact design.
3Measurement precision
If the connecting parts are made thinner to increase deformation, then the detection sensitivity is improved, but stress concentration occurs at the boundaries
Solution Approach 1:
The patent implements local quality by creating a thin area that includes the connecting parts, thereby increasing their degree of deformation and detection sensitivity. The boundaries of this thin area are strategically positioned in the supporting and operating parts rather than in the connecting parts themselves, which prevents stress concentration at critical locations while still achieving the desired sensitivity enhancement.
4Area of stationary object
If the chip is made compact without changing thickness, then the planar size is reduced, but the detection balance between axial and lateral forces deteriorates
Solution Approach 1:
The patent resolves the contradiction by introducing a change in the thickness dimension. Instead of merely reducing planar area, the invention creates a thin area with reduced thickness in the connecting parts region. This three-dimensional modification allows the chip to maintain detection balance between axial and lateral forces even when the planar area is reduced, as the varied thickness compensates for the area reduction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design allows for a favorable detection balance between axial forces even when the chip is made more compact, preventing chip damage and increasing detection sensitivity while minimizing stress concentration and noise.
Implementation Method 1
a plurality of strain resistance elements is integrally assembled in a specified arrangement pattern on parts of a strain-generating body on a semiconductor substrate
Data Source
AI summary
A force sensor chip having a multiaxial force sensing function is disclosed. The force sensor chip comprises a base member having an operating part provided with an external force application area, a supporting part for supporting the operating part, connecting parts for connecting the operating part and the supporting part, and strain resistance elements disposed in the connecting parts or within boundaries between the connecting parts and the operating part. The base member has a thin area formed with a small thickness, and the boundaries of the thin area are disposed in the supporting part and operating part.