Force Sensor Substrate Bonding for Stable Gap Accuracy

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing methods for manufacturing force sensors using a polyimide tape for fixation are prone to insufficient fixation, leading to variable gaps between substrates under different load conditions, which affects the accuracy of the sensor's positional relationship.

Innovation Solution

A method involving the preparation of substrates with metal arrays and layers, where a spacer member and thinner metal layers are formed and fused together to securely fix the substrates, maintaining a constant gap even when load is applied, using techniques like laser welding or direct bonding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If polyimide tape is used for fixation, then the manufacturing process is simple and easy to operate, but the fixation reliability is insufficient and the gap between substrates varies under load

Engineering Contradiction:
Improveease of manufactureVSAvoidfixation reliability
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The patent changes the fixation method from mechanical adhesion (polyimide tape) to thermal fusion (laser welding), altering the bonding mechanism parameters. This enables reliable fixation while maintaining manufacturing simplicity through direct melting and bonding of the metal layers without requiring additional adhesive materials or complex assembly steps.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent replaces the mechanical fixation system (polyimide tape adhesion) with a thermal-field-based system (laser welding). The laser beam provides non-contact heating that melts and fuses the metal layers, substituting mechanical bonding with thermal-energy-based bonding, thereby achieving both simplicity and reliability.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Ease of manufacture

If polyimide tape fixation is used, then the manufacturing process is simple, but the positional relationship between substrates changes under load affecting measurement precision

Engineering Contradiction:
Improveease of manufactureVSAvoidpositional relationship accuracy
Core Design Contradiction:
Ease of manufactureVSMeasurement precision

Solution Approach 1:

The patent changes the bonding mechanism from mechanical adhesion to thermal fusion, altering how the substrates are fixed. This parameter change ensures that the gap between substrates remains constant under various loads, thereby maintaining measurement precision while keeping the manufacturing process simple through direct laser welding of metal layers.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent substitutes the mechanical polyimide tape fixation system with a laser-based thermal welding system. This replacement eliminates the compliance and deformation issues associated with adhesive tapes under load, ensuring stable positional relationships and accurate measurements while maintaining ease of manufacture through a streamlined process.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Reliability

If metal layers are fused together, then the fixation reliability is improved, but the manufacturing process becomes more complex

Engineering Contradiction:
Improvefixation reliabilityVSAvoidmanufacturing process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent replaces complex mechanical fixation systems with laser welding, which uses thermal energy to fuse metal layers directly. This substitution achieves high reliability through strong metallurgical bonds while actually simplifying the manufacturing process by eliminating the need for additional fasteners, adhesives, or complex assembly procedures.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the bonding approach from mechanical or adhesive bonding to direct thermal fusion. By controlling laser parameters (power, speed, focus), the process achieves reliable fixation while maintaining simplicity, as the fusion process can be precisely controlled and automated without requiring complex tooling or multiple processing steps.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach ensures reliable fixation and maintains a constant gap between substrates, enhancing the accuracy and reliability of the force sensor's measurements by preventing variations in the positional relationship due to load changes.

Implementation Method 1

a laser beam is applied to the first metal layer and the second metal layer to fuse the first metal layer and the second metal layer together

Methodology Applied
Scientific EffectLaser heating: Laser

Implementation Method 2

to fuse the first metal layer and the second metal layer together

Methodology Applied
Scientific EffectMelting: Melting

Implementation Method 3

a first substrate which is made of a material that transmits electromagnetic waves and includes on its surface a metal array arranged in a periodic pattern and a second substrate which includes on its surface a metal layer that reflects electromagnetic waves

Methodology Applied
Scientific EffectElectromagnetic wave transmission: Electromagnetic Induction

Data Source

PatentUS20230266188A1Method for manufacturing force sensor
Publication Date: 2023.08.24 SINTOKOGIO LTD
  • US20230266188A1 patent drawing
  • US20230266188A1 patent drawing
  • US20230266188A1 patent drawing

AI summary

Provided is a method for manufacturing a force sensor including: preparing a first substrate which is made of a material that transmits electromagnetic waves and includes on its surface a metal array arranged in a periodic pattern and a second substrate which includes on its surface a metal layer that reflects electromagnetic waves; forming a spacer member on the surface of the first substrate; forming a first metal layer around the spacer member on the surface of the first substrate; forming a second metal layer in a region corresponding to the first metal layer on the second substrate; and fusing the first metal layer and the second metal layer together to fix the first substrate and the second substrate in a state in which the spacer member formed on the surface of the first substrate abuts the surface of the second substrate.