Force sensor with target on semiconductor package
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Solution Overview
Problem
Existing force sensors for robotic manipulation have a large footprint, making them unsuitable for delicate objects and requiring indirect force measurement, which can lead to faulty manipulation or damage.
Innovation Solution
A compact force sensor with a flexible piece attached to a semiconductor package, using a sensing element to measure changes in the magnetic field from a target piece, allowing for accurate force control with a small footprint.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a large block of flexible material with wide contact area is used to ensure reliable contact, then contact reliability is improved, but the footprint becomes large
Solution Approach 1:
The patent uses a thin flexible piece (flexible shell) instead of a large block of flexible material. This flexible piece is attached to the semiconductor package and deforms under force, allowing the sensing element to detect position changes while maintaining a compact footprint.
Solution Approach 2:
The patent extracts the flexible material from being a large contact block and transforms it into a thin flexible piece that serves as a mounting substrate for the target. This reduces the footprint while maintaining the necessary flexibility for force sensing.
2Adaptability or versatility
If indirect force measurement through deformation of contact surface is used, then force measurement capability is improved, but measurement precision deteriorates
Solution Approach 1:
The patent replaces indirect mechanical deformation measurement with direct position sensing using a magnetic field-based sensing element. The sensing element directly measures the position of the target on the flexible piece, providing more precise force measurement while maintaining the ability to sense forces through flexible material deformation.
3Adaptability or versatility
If a compact sensor with small footprint is used, then adaptability for delicate objects is improved, but contact reliability may worsen
Solution Approach 1:
The thin flexible piece maintains good contact with the object being manipulated while keeping the overall sensor footprint small. The flexibility of the thin film allows it to conform to delicate objects, ensuring reliable contact without requiring a large contact area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a sensitive and compact force sensor with a low profile, enabling precise force measurement and control, suitable for robotic manipulation of delicate objects without the need for large footprints.
Implementation Method 1
The sensing element is configured to sense changes of the magnetic field from motion of the target piece with respect to the sensing element
Data Source
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AI summary
A force sensor comprises a sensing system including a target piece and a sensing element, configured to provide changes of a magnetic field, being generated by motion of the target piece. The sensing element senses these changes and provides a signal representative of the position of the target piece. An integrated circuit with processing means can process signals from the sensing element. A semiconductor package includes at least the integrated circuit. A flexible piece comprises the target, and it is attached to the semiconductor package, where the attachment area between the flexible piece and the semiconductor package does not extend beyond the top projection, or outline, of the semiconductor package. The flexible piece receives a force stimulus, so that upon exerting a force on the flexible piece, the displacement of the target piece with respect to the surface of the semiconductor package can be sensed by the sensing element.