Earphone Force Sensor Patch Assembly for Space-Saving Pressure Detection
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Solution Overview
Problem
Conventional methods for assembling sensor circuits in electronic devices, such as earphones, require additional retention components that occupy significant internal space and complicate the assembly process.
Innovation Solution
A force sensor patch is integrated into the earphone device by being pasted onto specific electrodes of the printed circuit board, allowing it to detect user pressure and be used as a G-sensor, without occupying excessive space and simplifying the assembly process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional larger sensor circuit is assembled to an electronic device, then the sensor can detect user pressure, but additional retention assembly components are needed that occupy considerable internal circuit space
Solution Approach 1:
The patent applies this principle by using a flexible force sensor patch with adhesive layer that can be directly pasted onto the circuit board. The thin film structure eliminates the need for bulky retention assembly components while maintaining the sensor's detection capability, thus reducing the occupied internal circuit space.
Solution Approach 2:
The patent merges the sensor element and the retention function into a single integrated force sensor patch. The adhesive layer serves both as the sensing element and as the retention mechanism, eliminating the need for separate retention assembly components and reducing overall space occupation.
2Reliability
If additional retention assembly components are installed to keep the sensor circuit, then the sensor is securely retained, but the assembly procedure becomes complicated
Solution Approach 1:
The patent combines the sensor element and retention function into a single integrated force sensor patch. The adhesive layer serves dual purposes as both the sensing element and the retention mechanism, eliminating the need for separate retention assembly components and simplifying the assembly procedure to a single pasting operation.
Solution Approach 2:
The force sensor patch uses an adhesive layer that provides self-retention capability. The adhesive naturally bonds the sensor to the circuit board without requiring additional retention components or complex assembly steps, allowing the sensor to secure itself in place during the assembly process.
3Reliability
If a conventional larger sensor circuit is used, then the sensor provides adequate detection, but it occupies considerable internal circuit space of the electronic device
Solution Approach 1:
The patent employs a flexible force sensor patch that can be conformally attached to the circuit board surface. This thin film structure maintains adequate detection accuracy while occupying minimal area on the internal circuit board compared to conventional larger sensor circuits.
Solution Approach 2:
The patent changes the physical form factor parameter of the sensor from a conventional larger circuit to a compact force sensor patch. This parameter change reduces the area occupation on the circuit board while maintaining detection functionality through the specialized patch design.
Data Source
AI summary
An earphone device includes a housing subassembly, an inner casing subassembly, an audio processor, and a force sensor patch. The inner casing subassembly is disposed in the housing subassembly and integrated with a printed circuit board having specific electrode(s). The audio processor is disposed on the printed circuit board. The force sensor patch is pasted onto specific electrode(s) of the printed circuit board to be coupled to the audio processor through specific electrode(s). The force sensor patch is disposed between a part of the housing subassembly and a part of the inner casing subassembly and arranged to detect a user's pressure applied onto the part of the housing subassembly.