Force Sensor Sense Die Direct Substrate Contact
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Solution Overview
Problem
Conventional force sensors experience non-linear electrical output and increased height tolerance due to the compression of adhesives when measuring forces, which affects accuracy and linearity.
Innovation Solution
A force sensor design where the sense die directly contacts the substrate without adhesive, with a top part and bottom part configuration, where the bottom part is formed by etching the sense die material to remove it from the outer edges, allowing direct contact and reducing part-to-part variation, and incorporating an actuation element to transmit forces to the top part.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesive is used to secure the sense die to the substrate, then the sense die can be firmly attached, but the adhesive compression causes non-linear electrical output and increased height tolerance
Solution Approach 1:
The patent removes the adhesive layer from the force sensor assembly, extracting the harmful element that caused non-linear electrical output. The sense die is secured to the substrate through direct mechanical contact and structural integration, eliminating the adhesive compression that previously compromised measurement linearity and precision.
2Reliability
If adhesive is used to secure the sense die, then attachment is achieved, but height tolerance variation increases
Solution Approach 1:
The adhesive layer is completely removed from the assembly, eliminating the source of height tolerance variation. The sense die is positioned and secured through direct mechanical contact with the substrate, ensuring consistent height across all units and eliminating the part-to-part variation introduced by adhesive thickness variations.
3Reliability
If adhesive is used to secure the sense die, then the sense die is held in place, but the compression of adhesive affects measurement accuracy
Solution Approach 1:
The adhesive layer is extracted from the force sensor assembly, removing the compressible element that interfered with accurate force measurement. The sense die makes direct contact with the substrate, ensuring that applied forces are transmitted accurately without the distorting effect of adhesive compression.
Data Source
AI summary
A force sensor may comprise a sense die comprising a top part and a bottom part. Generally, the top part may comprise a first surface and a second surface, and the bottom part may comprise a first surface for direct contact with a substrate. Typically, the bottom part may be formed by removing a portion of the material of the sense die around the edges of a first face of the sense die. Typically, adhesive may replace the portion of the sense die material removed from the edges of the first face of the sense die. Thus, the adhesive may secure the first surface of the bottom part of the sense die directly to the substrate without serving as an interface between the bottom part of the sense die and the substrate.