Force Sensor Shock Absorber with Annular Grooves for Delamination Prevention
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Solution Overview
Problem
Conventional force sensors with shock absorbing devices face challenges in adjusting damping characteristics and risk of delamination at the joining surface between the chip seat and securing part, limiting their ability to effectively transmit external forces to the sensor chip without damaging the semiconductor substrate.
Innovation Solution
Incorporating a disc-shaped damping mechanism with annular grooves on the front and rear surfaces of the shock absorbing device, allowing for adjustable damping force by varying the groove depth and design, which effectively transmits axial components of external forces to the sensor chip while preventing delamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a shock absorbing device is provided to minimize external force applied to the semiconductor chip, then the measurement level and range of application are increased, but the complexity of the device structure increases
Solution Approach 1:
The shock absorbing device utilizes a porous material structure where pores are formed within the damping mechanism body. This porous structure allows the device to absorb and dampen external forces through the compression and expansion of pore spaces, providing effective shock absorption without requiring complex mechanical components. The porous structure achieves both protection of the semiconductor chip and maintains relatively simple device geometry.
2Reliability
If the damping characteristics are adjusted by manufacturing complex shapes or forming holes, then the external force damping performance is improved, but the ease of manufacture deteriorates
Solution Approach 1:
Instead of manufacturing complex shapes or individual holes through intricate machining processes, the patent employs a porous material approach where the damping mechanism is formed as a porous body. This can be achieved through simpler manufacturing methods such as foam molding, sintering, or other porous material formation techniques, significantly easing the manufacturing process while maintaining effective damping performance through the distributed pore structure.
3Measurement precision
If external force is transmitted to the chip through the joining surface, then the force detection function is achieved, but the risk of delamination at the joining surface increases
Solution Approach 1:
The patent introduces a pressing member that applies preliminary compressive force to the joining surface between the shock absorbing device and the semiconductor chip. This pre-compression creates initial contact pressure that prevents delamination during force measurement. The pressing member is positioned to apply this preliminary action before external forces are applied, ensuring the joining surface remains intact during operation while still allowing accurate force transmission to the chip.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the reproducibility and performance of the force sensor by allowing for precise adjustment of the force ratio transmitted to the chip and securing part, reducing the risk of delamination and improving the detection accuracy of external forces.
Implementation Method 1
a shock absorbing device for damping an external force and imparting the damped external force to the force sensor chip
Data Source
AI summary
A force sensor including a force sensor chip and a shock absorbing device that has a damping mechanism is disclosed. The damping mechanism is disc-shaped and has an annular groove formed in at least a front surface so as to dampen external force. The damping force is adjusted by varying the depth of the groove.