Force Sensor Substrate Slots to Prevent Thermal Track Fracture
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Solution Overview
Problem
Detection devices with force sensors experience deformation and breakage due to differing thermal expansion coefficients of the substrate and rigid adhesive, leading to unusable conductive tracks during heating.
Innovation Solution
Incorporation of a thermal protection arrangement with through slots in the substrate surrounding the adhesive area, along with a flexible adhesive layer to accommodate thermal expansion and prevent shear fracture of conductive tracks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If rigid adhesive is used to connect the force sensor and substrate, then mechanical strength is improved, but thermal deformation causes conductive track breakage
Solution Approach 1:
The substrate is segmented by creating through slots that divide the rigid adhesive layer into isolated regions. This segmentation allows each adhesive region to expand independently during thermal cycling, preventing shear fracture of the conductive tracks while maintaining strong mechanical bonding between the force sensor and substrate.
Solution Approach 2:
The invention applies different structural properties to different regions of the substrate. The areas with rigid adhesive have through slots for thermal accommodation, while other areas maintain continuous substrate structure for mechanical strength. This local differentiation resolves the contradiction between strong bonding and thermal expansion compatibility.
2Reliability
If through slots are added to the substrate for thermal protection, then thermal deformation is reduced, but device complexity increases
Solution Approach 1:
The through slots create a porous-like structure in the substrate that allows thermal expansion accommodation. This approach provides effective thermal protection while maintaining relatively simple manufacturing processes and avoiding the need for complex multi-layer or adjustable mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Preserves the integrity of the detection device by allowing local elastic deformation and reducing temperature rise, maintaining functionality despite differing thermal expansion coefficients of adhesives.
Implementation Method 1
the different elements of the detection device, notably the substrate and the rigid adhesive, have different coefficients of thermal expansion. Therefore, during the heating associated with the device's use, it is likely to deform
Implementation Method 2
allowing local elastic deformation and reducing temperature rise
Data Source
AI summary
A detection device that includes: a substrate having a first and a second side; a force sensor, attached to the first side of the substrate so as to cover a first area; and a conductive track extending on the first side from the force sensor. The detection device further includes: a layer of a first rigid adhesive, attached to the second side of the substrate, so as to cover a second area; the first and second areas being arranged opposite one another; and two through slots in the substrate, surrounding the second area, with the conductive track arranged between the two slots.