Multi-Substrate Force Sensor Structure for Thermal Deformation Resistance
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Solution Overview
Problem
Existing force sensors face challenges in thermal stability and mechanical durability, particularly in thermal deformation, which affects their performance and accuracy. The substrate portions are easily affected by thermal deformation, which affects their performance and accuracy. The substrate portions are easily affected by thermal changes. The substrate portions are designed to be thin in order to reduce the thickness of the force sensor, and therefore the substrate portions are designed to be thin in order to suppress the thermal deformation of the substrate portions through elastic deformation.
Innovation Solution
A force sensor with a first substrate, a second substrate, and a third substrate, connected by connection members that allow for elastic deformation in specific directions, and detection units to measure relative displacement, with thick portions to improve rigidity and thermal stability, and a processor with a heat reducing member to prevent thermal deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the substrate portions are made thin to reduce the thickness of the force sensor, then the overall thickness is reduced, but the substrate portions become more susceptible to thermal deformation
Solution Approach 1:
The second substrate is designed with non-uniform thickness: thin in the mounting region (for flexibility and detection) and thick in other regions (for thermal stability). This local quality differentiation allows the substrate to simultaneously achieve reduced overall thickness and improved thermal deformation resistance.
Solution Approach 2:
The second substrate is segmented into different thickness regions: a first thickness region (mounting region for detection units) and a second thickness region (other portions). This segmentation allows each region to serve its specific function while collectively solving the thermal deformation problem.
2Length of moving object
If the substrate portions are made thin to reduce the thickness of the force sensor, then the overall thickness is reduced, but the mechanical durability decreases
Solution Approach 1:
The substrate has different thicknesses in different regions: thin in the mounting region for detection flexibility and thick in other regions for mechanical strength. This local quality differentiation maintains mechanical durability while reducing overall thickness.
Solution Approach 2:
The substrate is divided into thickness regions with different mechanical properties, allowing the thin region to provide flexibility for detection and the thick region to provide structural support and durability.
3Measurement precision
If the processor is operated to calculate force components, then force measurement capability is improved, but heat generation increases causing thermal deformation
Solution Approach 1:
A heat insulating member is introduced as an intermediary between the processor and the second substrate. This intermediary blocks heat transmission from the processor to the substrate, preventing thermal deformation while allowing the processor to continue its force calculation operations.
Solution Approach 2:
The heat generation problem is isolated from the substrate by placing a heat insulating member between them, effectively extracting the thermal effect from the substrate system and preventing it from causing deformation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The force sensor effectively measures forces and moments with improved accuracy and thermal stability, and reduces the thermal deformation of the substrate, maintaining high detection accuracy and mechanical durability.
Implementation Method 1
a first connection member connecting the first substrate to the second substrate so that the first substrate and the second substrate are displaceable in the plate-thickness direction; a second connection member connecting the second substrate to the third substrate so that the second substrate and the third substrate are displaceable in a direction perpendicular to the plate-thickness direction
Implementation Method 2
The substrate portions are formed to be thin in order to reduce the thickness of the force sensor, and therefore the substrate portions are easily affected by thermal changes. The second substrate includes a thick portion in a region other than a mounting region of the second detection unit, the thick portion protruding toward the third substrate
Data Source
AI summary
A force sensor includes: a first substrate, a second substrate and a third substrate that are disposed so as to be spaced apart from each other in a plate-thickness direction; a first connection member connecting the first substrate to the second substrate so that the same are displaceable in the plate-thickness direction; a second connection member connecting the second substrate to the third substrate so that the same are displaceable in a direction perpendicular to the plate-thickness direction; a first detection unit configured to detect relative displacement between the first substrate and the second substrate; and a second detection unit disposed extending in the plate-thickness direction between the second substrate and the third substrate for detecting relative displacement between the second substrate and the third substrate. The second substrate includes a thick portion in a region other than a mounting region of the second detection unit.