Forced flow cooling temperature control method, system, and apparatus
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Solution Overview
Problem
Current methods for cooling superconducting supercomputers, such as large centralized refrigeration plants and cryocoolers, face challenges in scalability and efficiency due to long cabling and high power consumption, which hinder the achievement of desired operating temperatures for integrated circuits operating at 4 K and 77 K.
Innovation Solution
A forced flow cooling apparatus and method that uses a housing to surround circuit card subassemblies with separate temperature-control fluids, directing them laterally across the subassemblies to maintain distinct operating temperatures of 4 K and 77 K, minimizing thermal parasitic load and reducing the need for extensive cabling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a large centralized refrigeration plant is used to cool superconducting supercomputers, then the desired operating temperatures (4K and 77K) can be achieved, but the system requires long cabling between temperature zones which results in significant latency and high power consumption
Solution Approach 1:
The patent divides the circuit card into multiple temperature zones (first temperature zone at 4K and second temperature zone at 77K) that are physically separated and independently cooled. Each zone has its own cooling fluid flow path, eliminating the need for long cabling between temperature zones and reducing signal latency while maintaining independent temperature control.
2Temperature
If a large centralized refrigeration plant is used, then cooling capacity is sufficient, but the system requires extensive cabling which consumes significant power
Solution Approach 1:
The patent segments the cooling system into separate flow paths for different temperature zones. Each zone is cooled independently with its own temperature-control fluid flow, eliminating power consumption associated with long cabling and enabling efficient heat removal at each zone without requiring extensive interconnection infrastructure.
3Loss of energy
If separate cryogenic vessels are used for each temperature regime, then thermal parasitic load is minimized, but the system complexity and number of parts increase
Solution Approach 1:
The patent merges multiple temperature zones onto a single circuit card substrate, with each zone independently cooled by separate fluid flow paths. This integration reduces the number of separate cryogenic vessels and parts while maintaining thermal isolation between zones, thereby reducing thermal parasitic load without proportionally increasing system complexity.
4Length of stationary object
If a cryocooler is used for small scale applications, then the two temperature zones can be closer together, but the heat removal capacity is insufficient for large scale applications
Solution Approach 1:
The patent implements separate temperature-control fluid flow paths for each temperature zone, allowing each zone to be cooled independently with appropriate heat removal capacity. This segmentation enables the system to scale to large applications by providing sufficient cooling power to each zone without requiring the zones to be far apart, as each zone has dedicated cooling capacity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for efficient and scalable temperature control by minimizing thermal parasitic load and reducing power consumption, enabling closer proximity of temperature zones while maintaining low latency and high packaging density.
Implementation Method 1
The first temperature-control fluid is directed laterally across at least a portion of the first circuit card subassembly within the housing internal volume in a first flow path to induce the first operating temperature
Implementation Method 2
the second temperature-control fluid being directed laterally across at least a portion of the second circuit card subassembly within the housing internal volume in a second flow path to induce the second operating temperature
Data Source
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AI summary
An apparatus for providing forced flow cooling in a circuit card environment is provided includes at least one circuit card including first and second longitudinally spaced circuit card subassemblies, connected together into a single circuit card oriented substantially in a lateral-longitudinal plane. The first and second circuit card subassemblies have first and second operating temperatures, which are different from one another. A housing defines a housing internal volume which completely three-dimensionally surrounds the circuit card. A first temperature-control fluid is directed laterally across at least a portion of the first circuit card subassembly within the housing internal volume in a first flow path to induce the first operating temperature concurrently with a second temperature-control fluid being directed laterally across at least a portion of the second circuit card subassembly within the housing internal volume in a second flow path to induce the second operating temperature.