Form-in-place Conductive Colloid for EMI Shielding and Waterproofing
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Solution Overview
Problem
Existing colloid materials used in electronic product enclosures struggle to effectively isolate electromagnetic interference (EMI) and provide waterproof and dustproof capabilities, leading to potential harm and functional failures.
Innovation Solution
A form-in-place conductive and waterproof colloid composed of dimethyl siloxane, hydroxy terminated polydimethylsiloxane, Nickel Graphite, and other additives, which can be dispensed without a production mold, offering excellent adhesion, compressibility, resilience, and EMI shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional colloid materials are used for joining electronic product enclosures, then the enclosures can be assembled, but the colloid fails to effectively isolate electromagnetic interference (EMI) and provide adequate waterproof and dustproof capabilities
Solution Approach 1:
The patent uses a composite material system combining polysiloxane base polymers with conductive fillers (carbon black, graphite, metal powders) and crosslinking agents. This composite structure provides simultaneous EMI shielding through conductive pathways, waterproofing through dense crosslinked network, and structural flexibility, resolving the contradiction between assembly functionality and protection against harmful factors.
Solution Approach 2:
The patent modifies the chemical and physical parameters of the colloid by adjusting crosslinking density, filler concentration, and polymer chain flexibility. These parameter changes enable the material to achieve optimal balance between EMI isolation capability, waterproof performance, and mechanical properties required for enclosure assembly.
2Manufacturing precision
If production molds or die cutters are used to apply colloid, then precise application is achieved, but the process complexity and cost increase
Solution Approach 1:
The colloid composition is designed with inherent properties that enable self-aligned application without external molding tools. The material's viscosity, curing characteristics, and flow behavior allow it to automatically conform to the joint geometry, eliminating the need for production molds or die cutters while maintaining precise application.
Solution Approach 2:
By optimizing the rheological parameters (viscosity, thixotropy) and curing kinetics of the colloid, the patent enables the material to be applied in a controlled manner that self-limits spread and achieves precise positioning without requiring complex molding equipment.
3Ease of manufacture
If conventional colloid materials are used, then the application process is simple, but the material fails to provide adequate EMI shielding and waterproofing performance
Solution Approach 1:
The patent incorporates multiple functional components (conductive fillers for EMI shielding, hydrophobic agents for waterproofing, crosslinking agents for structural integrity) into a single colloid formulation. This composite approach maintains application simplicity while achieving superior EMI shielding and waterproofing performance that conventional single-function materials cannot provide.
Solution Approach 2:
The colloid is designed as a multi-functional material that simultaneously provides structural bonding, EMI shielding, waterproofing, and dustproofing capabilities. This universal material eliminates the need for separate application steps for different functions, maintaining ease of manufacture while achieving comprehensive protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution simplifies the application process, reduces costs, and provides effective EMI shielding and waterproofing, ensuring compliance with regulations, especially suitable for small devices with reduced material and implementation costs.
Implementation Method 1
50%-70% of Nickel Graphite
Implementation Method 2
dimethyl siloxane or dimethylvinyl-terminated or vinyl terminated polydimethylsiloxane; hydroxy terminated polydimethylsiloxane; dimethyl, methylhydrogen siloxane crosslinking agent
Implementation Method 3
0%-0.2% of Pt catalyst
Data Source
AI summary
The present invention discloses a form-in-place conductive and waterproof colloid, being composed of: dimethyl siloxane or dimethylvinyl-terminated or vinyl terminated polydimethylsiloxane; hydroxy terminated polydimethylsiloxane; dispersant; dimethyl, methylhydrogen siloxane crosslinking agent; adhesion promoter; Pt catalyst; forming agent; hydrocarbon solvent; Nickel Graphite; thickening agent; Trimethylated silica; and inhibitor. With the implementation of the present invention, no production mold or die cutter is required to simplify the process of applying the colloid and reduce the cost of applying, and with the characteristics of being providing waterproof and dustproof capability for enclosures, providing excellent adhesion capability, providing excellent compressibility and resilience, isolating EMI and providing EMI shielding capability at the same time. Besides, the space required is small when forming or applying making the colloid suitable for applications to small or mini devices and save the cost of material and cost of implementation.