Formable Insert Undermolding for Electronic Device Covers
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for attaching formable inserts, such as fabrics or leathers, to electronic device covers often result in a weak bond, leading to detachment and visible parting lines, which can be aesthetically unappealing and damage the insert.
Innovation Solution
A method involving a first frame portion with a smaller dimensional profile than the final part, allowing a foldable insert to be attached and sealed within a second frame portion using undermolding, eliminating the need for secondary trimming and hiding the perimeter edge from the exterior surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If insert molding is used to attach the insert to the cover, then the insert can be integrated with the cover, but the attachment is weak and the insert can detach
Solution Approach 1:
The insert is folded along a fold line before molding, creating a pre-formed configuration that allows the molding material to encapsulate and secure the insert edges more effectively, preventing detachment
Solution Approach 2:
The insert is folded from a flat state into a three-dimensional configuration with overlapping layers, creating additional attachment surfaces and mechanical interlocking that strengthens the bond between insert and cover
2Ease of manufacture
If the insert is attached via molding, then the insert is integrated with the cover, but visible parting lines form between the insert and cover
Solution Approach 1:
The insert is folded along a fold line before molding, positioning the perimeter edges and creating overlapping layers that allow the molding material to encapsulate the edges, hiding the parting line from the exterior surface
Solution Approach 2:
By folding the insert into three dimensions, the perimeter edges are repositioned to be encapsulated by the molding material, moving the parting line from a visible exterior feature to a hidden interior feature
3Ease of manufacture
If the insert is attached via molding, then the insert is integrated with the cover, but the edges of the insert fray or become damaged
Solution Approach 1:
The insert is folded along a fold line before molding, creating a pre-formed configuration that allows the molding material to encapsulate and protect the perimeter edges from fraying and damage
Solution Approach 2:
The insert is folded from a flat state into a three-dimensional configuration with overlapping layers, creating additional attachment surfaces and mechanical interlocking that strengthens the bond between insert and cover
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a robust and aesthetically appealing attachment of formable inserts, preventing fraying and damage by embedding the perimeter edges, thus enhancing the durability and appearance of the electronic device covers.
Implementation Method 1
molding resin is injected into the mold cavity to form the plastic substrate
Implementation Method 2
the insert bonds to the molding resin as the molding resin cools to form an integral part
Data Source
AI summary
Formable inserts and related methods are disclosed herein. An example of forming a cover with a formable insert includes forming a first frame portion of the cover, attaching a formable insert to the first frame portion of the cover, and forming a second frame portion of the cover subsequent to the formation of the first frame portion to capture a perimeter edge of the formable insert in the second frame portion of the cover.