Formed Interconnects with Concave Indentations for IC Packaging
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Solution Overview
Problem
The increasing demand for smaller, more functional, and high-speed electronic products poses a challenge in creating sufficient electrical connections within shrinking integrated circuit packages while maintaining precision and reliability, as existing solutions have not effectively addressed the need for increased connectivity and cost reduction.
Innovation Solution
The method involves forming interconnects with a concave indentation and a die paddle having a trench, allowing for precise placement of electrical connectors and encapsulation, which enhances connectivity and reliability by preventing relative movement and contamination, and is adaptable to various connector technologies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the package size is reduced to meet market demand for smaller electronic products, then the product size decreases, but the number of electrical connections that can be accommodated is reduced
Solution Approach 1:
The patent transitions from planar interconnect layouts to three-dimensional formed interconnects with vertical components. The interconnects extend vertically from the die paddle surface, utilizing the Z-dimension to increase connection density without expanding the package footprint. This dimensional transition allows multiple electrical connections to be stacked vertically, effectively increasing the number of connections per unit area.
Solution Approach 2:
The patent divides the interconnect structure into distinct segments: a vertical portion extending from the die paddle, a horizontal portion for electrical connection, and a formed shape portion with concave indentation. This segmentation allows each portion to be optimized independently for its specific function while collectively increasing the overall connection capacity within the reduced package size.
2Quantity of substance
If more electrical connections are added to smaller packages to increase functionality, then the connectivity increases, but the manufacturing precision requirements increase
Solution Approach 1:
The patent forms the interconnects with their final three-dimensional geometry and concave indentations before attaching the electrical connectors. This preliminary formation of the interconnect structure establishes precise registration features that guide and constrain the placement of subsequent components, thereby reducing the actual placement precision requirements during assembly.
Solution Approach 2:
The formed interconnects act as intermediary structures between the die paddle and the electrical connectors. The concave indentations in the interconnects provide mechanical engagement features that precisely position the connectors, serving as a mediating mechanism that translates the rigid die paddle geometry into precise connector placement without requiring ultra-precise direct positioning.
3Ease of manufacture
If traditional planar interconnects are used to maintain simple manufacturing, then the manufacturing complexity is low, but the board-level reliability is insufficient
Solution Approach 1:
The patent employs formed interconnects with curved or non-planar geometries, including concave indentations and three-dimensional shapes, rather than simple planar configurations. These formed shapes provide mechanical compliance and stress distribution that enhance board-level reliability while still being manufacturable using established forming and plating processes.
Solution Approach 2:
The patent changes the geometric parameters of the interconnects from two-dimensional planar shapes to three-dimensional formed shapes with varying cross-sections and profiles. This parameter change includes introducing vertical height, concave indentations, and optimized trace geometries that simultaneously improve mechanical reliability and maintain manufacturability through controlled deposition and forming processes.
4Device complexity
If conventional interconnect structures are used without formed shapes, then the device complexity is low, but the resistance to multi-directional forces is insufficient
Solution Approach 1:
The patent creates interconnects with dynamic, three-dimensional geometries that can accommodate and distribute mechanical stresses from multiple directions. The formed shapes include vertical portions that resist vertical forces, horizontal portions that resist lateral forces, and concave indentations that provide mechanical interlocking. This dynamic geometry allows the interconnects to withstand multi-directional forces applied during board-level testing and operation.
Solution Approach 2:
The interconnects are constructed as composite structures combining multiple materials: a conductive metal core (such as copper) for electrical conductivity, surrounded by a protective plating layer (such as nickel or gold) for mechanical strength and corrosion resistance. This composite construction provides both the electrical functionality and the mechanical strength needed to resist multi-directional forces while maintaining reasonable structural complexity.
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: providing a die paddle having an internal portion with a trench along a perimeter of the die paddle; forming an interconnect having a concave indentation and an upper portion, the upper portion, opposite the concave indentation, aligned horizontally to the internal portion;attaching an integrated circuit device on the die paddle, the trench between the integrated circuit device and the perimeter; attaching an electrical connector to the integrated circuit device and to the upper portion; and applying an encapsulation over the integrated circuit device, the electrical connector, the die paddle, and the interconnect, the concave indentation exposed below the encapsulation.