FOUP Airflow Redirection for Contamination-Safe Wafer Transfer

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Solution Overview

Problem

Existing substrate transport and handling systems in semiconductor fabrication fail to adequately prevent contamination from environmental factors like moisture and oxygen, leading to potential corrosion and oxidation during the transfer of substrates between processing tools and storage carriers.

Innovation Solution

An air flow optimization device is introduced, which modifies the direction and flow rate of down flow gas to prevent it from entering the substrate carrier when the door is open, using a control device with extension plates to redirect the gas flow obliquely away from the carrier, thereby maintaining a controlled environment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If down flow gas is provided to prevent contamination, then substrate protection is improved, but gas may enter the substrate carrier when door is open causing contamination

Engineering Contradiction:

Improvesubstrate protectionVSAvoidcontamination

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

An air flow optimizer device is introduced as an intermediary component between the down flow gas source and the substrate carrier. This device redirects the gas flow direction to be oblique relative to the carrier opening, allowing the gas to protect the substrate from contamination while preventing the gas itself from entering the carrier when the door is open.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The solution changes the dimensionality of the gas flow by redirecting it from a vertical down flow to an oblique flow direction. The air flow optimizer redirects gas at an angle that allows it to cover the substrate area for protection without directly entering the carrier opening, effectively using directional modification to resolve the contradiction.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Ease of operation

If FOUP door is opened for substrate access, then substrate transport is enabled, but environmental contamination can enter the carrier

Engineering Contradiction:

Improvesubstrate accessVSAvoidenvironmental contamination

Core Design Contradiction:

Ease of operationVSObject-affected harmful factors

Solution Approach 1:

The air flow optimizer is positioned and configured to redirect gas flow before the substrate carrier door is opened. This preliminary redirection ensures that when the door is opened for substrate access, the protective gas flow is already in place and directed obliquely, preventing environmental contamination from entering while maintaining substrate accessibility.

Inventive Principle:

Principle #10Preliminary action

3Object-affected harmful factors

If vertical down flow gas is used, then contamination prevention is improved, but gas enters the carrier opening when door is open

Engineering Contradiction:

Improvecontamination preventionVSAvoidgas flow control

Core Design Contradiction:

Object-affected harmful factorsVSEase of operation

Solution Approach 1:

The air flow optimizer redirects the vertical down flow gas into an oblique flow direction. This dimensional change in flow direction allows the gas to maintain its protective function against contamination while avoiding direct entry into the carrier opening when the door is open, thus improving ease of operation.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

4Productivity

If aggressive scaling down is implemented, then production efficiency is improved, but substrate contamination risk increases

Engineering Contradiction:

Improveproduction efficiencyVSAvoidcontamination risk

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The air flow optimizer serves as an intermediary device that enhances the existing clean room environment and FOUP protection system. By redirecting gas flow obliquely, it provides an additional layer of protection against contamination, enabling aggressive scaling down to proceed with maintained substrate integrity and reduced contamination risk.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively minimizes the risk of contamination by ensuring that down flow gas does not enter the substrate carrier, reducing the risk of corrosion and oxidation, and maintaining the integrity of the substrates during transport and storage.

Implementation Method 1

modifies the direction and flow rate of down flow gas to prevent it from entering the substrate carrier when the door is open, using a control device with extension plates to redirect the gas flow obliquely away from the carrier

Methodology Applied

Scientific EffectGas flow redirection:

Data Source

PatentUS12142507B2Systems and methods for air flow optimization in environment for semiconductor device

Publication Date: 2024.11.12 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A system comprises a front opening universal pod (FOUP) configured to hold one or more semiconductor wafers and a load dock having a stage and a receiving portion extending above the stage. The FOUP is positioned on the stage. A fan filter unit (FFU) positioned above the load dock. An air flow optimizer device is disposed on the receiving portion and under the FFU. The air flow optimizer device has an inlet opening and an outlet opening and a channel extends between the inlet opening and the outlet opening.