FOUP Cover Removal Exhaust System for Oxygen Control
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Solution Overview
Problem
Conventional cover opening/closing apparatuses fail to sufficiently exhaust oxygen, leading to inadequate nitrogen replacement during the removal of FOUP covers, resulting in increased oxygen concentrations in wafer conveyance areas and suboptimal processing conditions for semiconductor wafers.
Innovation Solution
The apparatus includes a cover removal system with a latch key, driving unit, and an exhaust system that exhausts the internal space within the accommodation unit, ensuring nitrogen replacement by closely contacting the opening edge of the substrate outlet with the wafer conveyance port and utilizing an exhaust line connected to a vacuum pump to reduce oxygen concentrations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If nitrogen gas is purged between the opening/closing door and the FOUP, then oxygen concentration is reduced, but the exhaust system is insufficient leading to inadequate nitrogen replacement
Solution Approach 1:
The exhaust system is divided into multiple exhaust ports distributed at different locations within the wafer conveyance port. This segmentation allows oxygen to be exhausted from multiple points simultaneously, improving nitrogen replacement efficiency and reducing oxygen concentration more effectively than a single exhaust point.
Solution Approach 2:
The exhaust ports are arranged in both horizontal and vertical directions, creating a three-dimensional exhaust network. This multi-dimensional arrangement ensures comprehensive coverage of the wafer conveyance port interior, preventing oxygen accumulation in any region and enhancing the overall nitrogen replacement process.
2Adaptability or versatility
If the cover removal apparatus is added to the opening/closing door, then cover removal function is improved, but the internal space of the apparatus accumulates oxygen
Solution Approach 1:
The exhaust system is activated before the cover removal apparatus operates, and continues to exhaust during the cover removal process. This preliminary and continuous exhaust action prevents oxygen from accumulating in the internal space of the opening/closing door and cover removal apparatus, maintaining a low-oxygen environment throughout the operation.
3Reliability
If the FOUP is hermetically sealed, then wafer protection is improved, but oxygen exhaust during cover removal becomes insufficient
Solution Approach 1:
The exhaust ports are strategically positioned at specific locations within the wafer conveyance port where oxygen is most likely to accumulate during cover removal. This localized exhaust approach targets the critical areas needing oxygen removal while maintaining the overall hermetic sealing of the FOUP for wafer protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables quick and sufficient nitrogen replacement, reducing oxygen concentrations and ensuring optimal processing conditions for semiconductor wafers by effectively exhausting the internal spaces within the cover opening/closing apparatus.
Implementation Method 1
an exhaust system configured to exhaust a space within the accommodation unit
Data Source
AI summary
Provided is a cover opening/closing apparatus which includes: a wafer conveyance port having an opening edge and configured to be opened/closed by an opening/closing door; and a cover removal apparatus installed on the opening/closing door and configured to remove a cover of a FOUP which is formed with a substrate outlet having a opening edge. When the cover removal apparatus removes the cover of the FOUP, the opening edge of the substrate outlet is closely contacted with the opening edge of the wafer conveyance port. The cover removal apparatus includes: a latch key which is engaged with the cover of the FOUP, a driving unit configured to drive the latch key, and an accommodation unit configured to accommodate the driving unit. The cover opening/closing apparatus further includes an exhaust system configured to exhaust a space within the accommodation unit.