FOUP Door Cleaning via Pressurized Gas Flow
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Solution Overview
Problem
Semiconductor substrate storage articles, such as FOUPs, face challenges in cleaning due to the trapping of liquids in high aspect ratio openings, which complicates the drying process and can lead to contamination.
Innovation Solution
A cleaning system that utilizes a gaseous flow to prevent liquids from entering or expelling from openings during the wet cleaning process, combined with contact points that partially or completely cover these openings to minimize liquid retention, ensuring effective drying and preventing contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If FOUPs and other articles are cleaned using special cleaning and drying equipment, then the cleanliness of substrates is improved, but the complexity of each cleaning cycle increases
Solution Approach 1:
The patent applies pneumatic principles by using pressurized gas flows to clean and dry FOUP articles. Gas nozzles deliver high-velocity gas streams to remove particles and drying the article surface, eliminating the need for complex liquid cleaning and drying equipment while achieving high cleanliness standards.
2Manufacturing precision
If the number of cleaning cycles increases to meet stricter cleanliness requirements, then substrate contamination is reduced, but the time needed for cleaning increases
Solution Approach 1:
The patent implements continuous cleaning action by maintaining constant gas flow across the article surface throughout the cleaning process. The gas jet system continuously removes particles and dries the surface in a single uninterrupted operation, eliminating the need for multiple sequential cleaning cycles and significantly reducing total cleaning time.
3Adaptability or versatility
If FOUP doors and bodies include numerous openings for engagement and coupling, then substrate handling functionality is improved, but liquid trapping during cleaning complicates the drying process
Solution Approach 1:
The patent uses pressurized gas flows to penetrate and dry liquid from complex openings, cavities, and crevices in FOUP doors and bodies. The high-velocity gas streams effectively remove trapped liquid from difficult-to-reach areas without requiring disassembly or special drying procedures, maintaining ease of operation despite complex geometries.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system efficiently prevents liquid retention in difficult-to-dry areas, simplifying the drying process and maintaining cleanliness, thereby reducing contamination risks and increasing the efficiency of semiconductor substrate storage article cleaning.
Implementation Method 1
The openings can be protected with a gaseous flow, for example, during the wet cleaning process. The gaseous flow can minimize or prevent the liquid from entering the openings, or can expel any liquid from the openings.
Implementation Method 2
The contact points may be also used for supporting the article and for pressurizing the openings in the article with a gas. The gas may be supplied through one or more contact points. It prevents liquids from getting into the openings if even the openings are not completely sealed.
Data Source
Figure 1A~1B
Figure 2
Figure 3A~3F
AI summary
Provided are methods and systems for cleaning various semiconductor substrate storage articles, in particular, FOUP doors. The FOUP doors and other similar articles often have openings that may get contaminated with cleaning liquids if not covered. The described cleaning system includes contact points for engaging the article and covering these openings. The contact points may be also used for supporting the article and for pressurizing the openings in the article with a gas. The gas may be supplied through one or more contact points. It prevents liquids from getting into the openings if even the openings are not completely sealed. The pressurization may be maintained through the entire wet portion of the cleaning process. The article may be rotated within the cleaning system while cleaning and/or other liquids or gases are dispensed through a set of spraying nozzles. Spraying nozzles may move to enhance cleaning of the article.