FOUP Temperature Control Using Inert Gas and Segmented Detectors

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Solution Overview

Problem

In semiconductor fabrication, precise temperature monitoring and control of semiconductor substrates within front opening unified pods (FOUPs) are essential to prevent defects such as device drift, gate oxide damage, and thermal issues, which existing technologies do not adequately address.

Innovation Solution

A temperature monitor system comprising a temperature detector, such as a thermographic camera, and a programmable controller, along with a data transfer module, is integrated into the FOUP to detect and control temperature in real-time, using inert gas for temperature adjustments, ensuring precise temperature management.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If temperature monitoring and control system is integrated into FOUP, then temperature control precision is improved, but device complexity increases

Engineering Contradiction:
Improvetemperature control precisionVSAvoiddevice complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The temperature monitoring system is segmented into separate functional modules: temperature detectors (infrared sensors or thermocouples) positioned at different locations within the FOUP, a control unit for processing temperature data, and inert gas delivery systems with nozzles. This modular segmentation allows precise temperature monitoring without requiring a completely complex integrated system, as each component performs a specific function independently.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

An inert gas (such as nitrogen) is introduced as an intermediary substance to transfer thermal energy to or from the semiconductor substrates. The inert gas acts as a mediator that can be delivered through nozzles positioned near the substrates, enabling temperature adjustment without direct contact with the substrates themselves, thus maintaining cleanliness while achieving precise thermal control.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Manufacturing precision

If real-time temperature monitoring is implemented, then manufacturing precision is improved, but use of energy increases

Engineering Contradiction:
Improvemanufacturing precisionVSAvoiduse of energy
Core Design Contradiction:
Manufacturing precisionVSUse of energy by moving object

Solution Approach 1:

Instead of continuous temperature monitoring and adjustment, the system employs periodic action by introducing inert gas in controlled cycles or pulses. The inert gas delivery can be activated only when temperature deviations are detected, rather than operating continuously. This periodic operation reduces energy consumption while still maintaining the manufacturing precision required for preventing thermal-related defects in semiconductor substrates.

Inventive Principle:
Principle #19Periodic action

3Reliability

If temperature control system is added to FOUP, then reliability is improved, but ease of operation deteriorates

Engineering Contradiction:
ImprovereliabilityVSAvoidease of operation
Core Design Contradiction:
ReliabilityVSEase of operation

Solution Approach 1:

The temperature control system is designed to operate autonomously through self-service mechanisms. Temperature detectors continuously monitor substrate temperatures and automatically trigger inert gas delivery when deviations from the desired temperature range are detected. The control unit processes sensor data and activates the inert gas nozzles without requiring manual intervention, thereby maintaining high reliability while preserving ease of operation. The system essentially monitors and corrects temperature issues automatically.

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This system effectively monitors and controls the temperature of semiconductor substrates within FOUPs, preventing thermal-related defects by providing accurate data and enabling precise temperature adjustments, thus enhancing the reliability of semiconductor manufacturing processes.

Implementation Method 1

A temperature detector, such as a thermographic camera

Methodology Applied
Scientific EffectThermal radiation: Thermal Radiation

Data Source

PatentUS10156478B2System and method of monitoring and controlling temperature of semiconductor substrates in FOUP
Publication Date: 2018.12.18 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US10156478B2 patent drawing
  • US10156478B2 patent drawing
  • US10156478B2 patent drawing

AI summary

A temperature monitor system for semiconductor substrates in a front opening unified pod (FOUP) includes a temperature detector and a programmable controller. The temperature detector is in the FOUP and configured to obtain temperature data of semiconductor substrates. The programmable controller is coupled to the temperature detector and configured to control operation of the temperature detector.