FOUP Inspection Chamber for Non-Invasive Defect Detection
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Solution Overview
Problem
Semiconductor wafer processing faces challenges in efficiently inspecting front opening unified pods (FOUPs) for damages and contamination, which can lead to mishandling and reduced manufacturing effectiveness.
Innovation Solution
An inspection system utilizing a combination of detection devices such as cameras, ultrasonic detection devices, and weight measurement systems to assess the condition and content of FOUPs, including cameras with adjustable fields of view and light sources for detailed imaging, and ultrasonic detection for internal defects, minimizes contamination risks without opening the container.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional inspection methods are used to inspect FOUPs for damages and contamination, then inspection can be performed, but the container must be opened which leads to contamination risks and reduced manufacturing effectiveness
Solution Approach 1:
The patent introduces an intermediary inspection chamber that allows optical detection devices to examine the FOUP container without opening it. The chamber serves as a mediator between the inspection system and the sealed container, enabling non-invasive detection of damages and contamination while maintaining the container's closed state to prevent contamination risks.
Solution Approach 2:
The patent replaces mechanical opening operations with optical detection methods. Instead of physically opening the FOUP container for inspection, the system uses optical sensors and imaging devices to detect damages and contamination through the closed container, eliminating the need for mechanical intervention that could introduce contamination.
2Measurement precision
If the FOUP is opened for inspection, then internal defects can be detected, but contamination can occur and manufacturing effectiveness is reduced
Solution Approach 1:
The patent implements preliminary inspection of FOUP containers before they enter the wafer processing line. By detecting potential damages and contamination issues beforehand through non-invasive optical methods, defective containers can be identified and removed prior to opening, preventing contamination during subsequent handling and maintaining manufacturing effectiveness.
Solution Approach 2:
The inspection chamber acts as an intermediary that enables precise defect detection without requiring the FOUP to be opened. Optical detection devices examine the container through its closed state, allowing thorough inspection of internal and external surfaces while maintaining the seal integrity and preventing contamination.
3Reliability
If multiple detection devices are used to thoroughly inspect the container, then inspection accuracy improves, but device complexity increases
Solution Approach 1:
The patent employs a multi-functional inspection chamber that integrates multiple detection capabilities within a single unified system. The chamber accommodates various optical detection devices (cameras, sensors, imaging devices) that can examine different aspects of the FOUP container, allowing thorough inspection through a single integrated platform rather than multiple separate systems.
Solution Approach 2:
The inspection system is segmented into functional modules within the inspection chamber, with each detection device targeting specific inspection tasks. This modular segmentation allows the system to achieve comprehensive inspection coverage through coordinated operation of specialized sub-systems, managing overall complexity through functional division.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively identifies damages and defects in FOUPs, ensuring they are in immaculate condition for handling, preventing contamination and enhancing the reliability of wafer processing by providing accurate and non-invasive inspections.
Implementation Method 1
a camera, the detection data being provided as image data
Implementation Method 2
ultrasonic detection devices, and weight measurement systems to assess the condition and content of FOUPs
Implementation Method 3
light sources for detailed imaging
Data Source
AI summary
The invention relates to an inspection system adapted for determining a state and/or content of a wafer or reticle container or at least a part of a wafer or reticle container, comprising a detection device or a multitude of detection devices (102, 104, 152, 154, 156, 158, 160, 164) adapted to receive detection data from a surface and/or interior of the wafer or reticle container or the part of a wafer or reticle container indicative of the state and/or content of the wafer or reticle container or the part of a wafer or reticle container.