Semiconductor FOUP Storage Shelf With Multi-Stage Vibration Isolation
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Solution Overview
Problem
Existing storage shelves for semiconductor wafers face challenges in reducing vibration while maintaining load-carrying capacity, as setting a lower spring constant for vibration-isolating members compromises the ability to support the load effectively.
Innovation Solution
A storage shelf design that incorporates multiple elastic bodies in series, with a higher rigidity elastic body positioned near the lid of the FOUP to counterbalance the weight and prevent tilting, and a frame unit secured to a rail or supporting member to isolate vibrations from the traveling vehicle.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the spring constant of the vibration-isolating member is set lower to reduce vibration, then the vibration-isolating effect is improved, but the load-carrying capacity deteriorates
Solution Approach 1:
The placement unit is divided into a frame and a shelf plate as separate components, connected by elastic bodies. This segmentation allows the frame to be supported by the frame unit through elastic bodies while the shelf plate is supported by the frame through additional elastic bodies, creating a multi-stage vibration isolation system that maintains load-carrying capacity at each stage
Solution Approach 2:
The shelf plate is nested on the frame, which itself is nested on the frame unit, with elastic bodies interposed at each interface. This nested structure with series elastic bodies creates cumulative vibration isolation while distributing the load across multiple support points
2Object-affected harmful factors
If elastic bodies are provided in series to reduce vibration, then the vibration-isolating effect is improved, but the height of the placement unit increases
Solution Approach 1:
The elastic bodies are arranged not only vertically between the frame and frame unit but also horizontally between the shelf plate and frame. This multi-dimensional arrangement of elastic bodies provides vibration isolation in multiple directions while optimizing the vertical height of the placement unit
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces vibration while maintaining load-carrying capacity and preventing the FOUP from tilting, allowing for efficient storage of wafers in a semiconductor conveyance system.
Implementation Method 1
a first elastic body interposed therebetween and a shelf plate that is arranged on the frame with a second elastic body interposed therebetween
Implementation Method 2
the receiving base on which a load is placed is provided with a viscoelastic body
Implementation Method 3
a third elastic body arranged between the frame and the shelf plate and having rigidity higher than those of the first and the second elastic bodies
Data Source
Figure 1
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AI summary
A storage shelf that can reduce vibration while maintaining load-carrying capacity is provided. The storage shelf 1 includes: placement units 20a, 20b, 20c, and 20d on which a FOUP 100 is placed; and a frame unit 10 that supports the placement units 20a to 20d. The placement units 20a and 20c include: frames 22a and 22c that are arranged on the frame unit 10 with first elastic bodies 40 and 41 interposed therebetween; and a shelf plate 24 that is arranged on the frames 22a and 22c with second elastic bodies 60 and 61 interposed therebetween and is configured to place thereon the FOUP 100.