FOUP Support Structure for Mixed Wafer and Panel Sizes
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Solution Overview
Problem
Existing semiconductor manufacturing equipment, such as FOUPs and cassettes, are typically fixed in size to accommodate one type of wafer or panel, leading to higher manufacturing costs and limited flexibility to handle the variety of wafer and panel sizes and shapes, which affects yield and manufacturing efficiency.
Innovation Solution
A FOUP system and method that accommodates multiple sizes and shapes of wafers and panels by using a common set of dimensions with adjustable horizontal support members and wings to overlap and support different sizes and shapes simultaneously, allowing for flexible handling and processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If FOUP is fixed in size to accommodate one type of wafer or panel, then structural simplicity is maintained, but adaptability to handle various sizes and shapes deteriorates
Solution Approach 1:
The patent applies dynamics by making the horizontal support members adjustable rather than fixed. The support members can be repositioned along the FOUP structure to accommodate different wafer and panel sizes, transforming a static structure into a dynamic one that adapts to various configurations without requiring multiple specialized equipment pieces
Solution Approach 2:
The patent implements universality by designing a single FOUP structure that can handle multiple types of wafers and panels through adjustable support members. This multi-functional design eliminates the need for separate equipment for different wafer sizes and shapes, allowing one device to serve multiple purposes across various manufacturing scenarios
2Adaptability or versatility
If multiple fixed-size FOUPs are used to handle different wafer sizes, then handling precision is maintained, but manufacturing cost increases
Solution Approach 1:
The patent reduces manufacturing costs by replacing multiple specialized FOUPs with a single universal FOUP that uses adjustable support members. This eliminates the need to purchase, maintain, and operate multiple fixed-size units, directly reducing capital expenditure and operational costs while maintaining the ability to handle various wafer sizes
Solution Approach 2:
The patent merges the functionality of multiple fixed-size FOUPs into one unified adjustable structure. By combining what would have been separate equipment units into a single system with reconfigurable support members, the patent achieves cost savings while consolidating equipment resources
3Productivity
If fixed-size FOUP is used, then structural stability is maintained, but processing efficiency for mixed wafer sizes deteriorates
Solution Approach 1:
The adjustable support members enable dynamic reconfiguration of the FOUP structure to optimize for different wafer sizes and mixing scenarios. This dynamic capability allows the system to efficiently handle mixed wafer sizes in a single batch, improving productivity without requiring multiple separate processing runs
Data Source
AI summary
A front opening unified pod has a housing and a plurality of horizontal support members disposed within the housing and adapted to accommodate a plurality of semiconductor wafers or panels. The plurality of semiconductor wafers or panels have a different size or shape, such as circular and rectangular. A first one of the plurality of horizontal support members has a wing to support the plurality of different size or shape semiconductor wafers or panels. The plurality of horizontal support members has a first side horizontal support member, a second side horizontal support member, and a center horizontal support member disposed between the first side horizontal support member and the second side horizontal support member. The plurality of horizontal support members is insertable into the housing. One or more of the plurality of horizontal support members has an opening for laser identification.