Four-Electrode Plasma Tube Layout for Cooler Substrate Processing
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Solution Overview
Problem
Batch type substrate processing apparatuses face issues with electrode damage and temperature increase due to plasma-induced ion collisions and heat generation, leading to increased resistance and energy, which can further damage the electrodes.
Innovation Solution
A batch type substrate processing apparatus with a four-electrode structure, including first and second power supply electrodes and first and second ground electrodes, protected by electrode protection tubes, and a cooling gas supply system to manage temperature and reduce plasma damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If high frequency power is supplied to electrodes to generate plasma, then plasma generation is achieved, but electrode temperature increases and electrodes are damaged by ion collisions
Solution Approach 1:
The patent introduces a cooling gas flow as an intermediary between the plasma environment and the electrodes. The cooling gas absorbs heat from the electrode surfaces and carries it away, protecting the electrodes from direct thermal damage while allowing plasma to be generated. This mediator approach resolves the contradiction by decoupling the plasma generation function from the electrode thermal management function.
Solution Approach 2:
The patent employs a pneumatic cooling system where cooling gas is supplied to the electrodes through gas supply holes. This pneumatic approach uses fluid flow (gas) to remove heat from the electrodes, enabling continuous operation at high power levels without electrode damage. The gas flow system provides dynamic thermal management that adapts to varying plasma generation requirements.
2Power
If high frequency power is supplied to electrodes, then plasma is generated, but electrode resistance increases due to temperature rise
Solution Approach 1:
The cooling gas acts as a thermal intermediary that prevents heat accumulation in the electrodes. By continuously removing heat, the cooling gas maintains electrode temperature and resistance at acceptable levels, ensuring efficient energy utilization for plasma generation rather than wasted heat. This resolves the energy efficiency problem caused by thermal runaway.
Solution Approach 2:
The patent dynamically manages electrode temperature parameters through controlled cooling gas flow. By adjusting the cooling gas flow rate and temperature, the system optimizes electrode operating conditions to maintain low resistance while enabling high power plasma generation. This parameter control approach balances power efficiency with plasma generation capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The four-electrode structure reduces high frequency power requirements, minimizes electrode damage, and maintains uniform plasma density, enhancing the lifespan of the electrodes and improving processing uniformity across multiple substrates.
Implementation Method 1
a plurality of first electrode protection tubes, each of which has a closed upper end and an opened lower end, and which have inner spaces in which the first and second power supply electrodes are inserted, respectively
Implementation Method 2
an electrode protection part configured to protect the plurality of electrodes
Implementation Method 3
The batch type substrate processing apparatus may supply high frequency power to a plurality of electrodes to generate plasma and thus supplies radicals, which are obtained by exciting a process gas injected around a plurality of electrodes
Implementation Method 4
the plurality of electrodes may be configured to generate capacitively coupled plasma (CCP) in a spaced space between the first power supply electrode and the first ground electrode and a spaced space between the second power supply electrode and the second ground electrode
Implementation Method 5
there is a demand for a configuration capable of lowering temperatures of a plurality of electrodes and ambient temperatures of the electrodes while preventing damage to the plurality of electrodes
Data Source
AI summary
Provided is a batch type substrate processing apparatus that generates plasma by a plurality of electrodes to perform a processing process on a substrate. The batch type substrate processing apparatus includes a reaction tube, a plurality of electrodes, and an electrode protection part. The plurality of electrodes includes first and second power supply electrodes spaced apart from each other and first and second ground electrodes provided between the first power supply electrode and the second power supply electrode to correspond to the first power supply electrode and the second power supply electrode, respectively. The electrode protection part includes a plurality of first electrode protection tubes which have inner spaces in which the first and second power supply electrodes are inserted, respectively, a plurality of second electrode protection tubes which have inner spaces in which the first and second ground electrodes are inserted, respectively, and a plurality of bridge parts configured to connect upper ends of the first electrode protection tube and the second electrode protection tube, which face each other, to each other, respectively.